公开(公告)号：US07663234B2

公开(公告)日：2010-02-16

申请号：US11420453

申请日：2006-05-25

申请人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

发明人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US07303400B2

公开(公告)日：2007-12-04

申请号：US11050814

申请日：2005-01-27

申请人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

发明人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC分类号： H01R12/00

CPC分类号： H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20050161756A1

公开(公告)日：2005-07-28

申请号：US11050814

申请日：2005-01-27

申请人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

发明人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20060113654A1

公开(公告)日：2006-06-01

申请号：US11328316

申请日：2006-01-10

申请人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

发明人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20050161815A1

公开(公告)日：2005-07-28

申请号：US10764469

申请日：2004-01-27

申请人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

发明人： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.