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1.发明授权Package of a semiconductor device with a flexible wiring substrate and method for the same 有权具有柔性布线基板的半导体器件的封装及其方法公开(公告)号：US07663234B2
公开(公告)日：2010-02-16
申请号：US11420453
申请日：2006-05-25
申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
发明人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
CPC分类号： H01L27/14618 , H01L23/49816 , H01L23/4985 , H01L27/14621 , H01L27/14627 , H01L27/14634 , H01L27/14683 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/16235 , H05K3/323 , H05K3/361 , H05K2201/0367 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。
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2.发明授权Package of a semiconductor device with a flexible wiring substrate and method for the same 有权具有柔性布线基板的半导体器件的封装及其方法公开(公告)号：US07303400B2
公开(公告)日：2007-12-04
申请号：US11050814
申请日：2005-01-27
申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
发明人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
IPC分类号： H01R12/00
CPC分类号： H01L27/14618 , H01L23/49816 , H01L23/4985 , H01L27/14621 , H01L27/14627 , H01L27/14634 , H01L27/14683 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/16235 , H05K3/323 , H05K3/361 , H05K2201/0367 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。
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3.发明申请Package of a semiconductor device with a flexible wiring substrate and method for the same 有权具有柔性布线基板的半导体器件的封装及其方法公开(公告)号：US20050161756A1
公开(公告)日：2005-07-28
申请号：US11050814
申请日：2005-01-27
申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
发明人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen , Kevin Lee , Jui-Hsiang Pan
IPC分类号： H01L21/00 , H01L21/48 , H01L23/48 , H01L23/498 , H01L27/146 , H01L31/0203 , H05K3/32 , H05K3/36
CPC分类号： H01L27/14618 , H01L23/49816 , H01L23/4985 , H01L27/14621 , H01L27/14627 , H01L27/14634 , H01L27/14683 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/16235 , H05K3/323 , H05K3/361 , H05K2201/0367 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。
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4.发明申请Package of a semiconductor device with a flexible wiring substrate and method for the same 审中-公开具有柔性布线基板的半导体器件的封装及其方法公开(公告)号：US20060113654A1
公开(公告)日：2006-06-01
申请号：US11328316
申请日：2006-01-10
申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
发明人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L23/49816 , H01L23/4985 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H05K3/323 , H05K3/361 , H05K2201/0367 , H01L2924/00014 , H01L2924/00
摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
摘要翻译： 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。
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5.发明申请公开(公告)号：US20050161815A1
公开(公告)日：2005-07-28
申请号：US10764469
申请日：2004-01-27
申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
发明人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
IPC分类号： H01L21/00 , H01L21/48 , H01L23/48 , H01L23/498 , H01L27/146 , H01L31/0203 , H05K3/32 , H05K3/36
CPC分类号： H01L27/14618 , H01L23/49816 , H01L23/4985 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H05K3/323 , H05K3/361 , H05K2201/0367 , H01L2924/00014 , H01L2924/00
摘要： A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
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公开(公告)号：US20060057764A1
公开(公告)日：2006-03-16
申请号：US10711377
申请日：2004-09-15
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.
摘要翻译： 提供了包括图像感测装置层，绝缘体上硅（SOI）层，光学装置阵列和基板的图像传感器。 SOI层具有第一表面和第二表面。 图像感测装置层形成在SOI层的第一表面上。 光学器件阵列形成在SOI层的第二表面上。 衬底设置在SOI层的第二表面上方，并且光学器件阵列设置在衬底和SOI层之间。 来自外部环境的入射光通过光学器件阵列和SOI层，并且由形成在图像感测器件层中的感测器件接收。 以这种方式，入射光的吸收或反射的概率降低。 因此，提高了本发明的图像传感器的感测性能和产量。
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公开(公告)号：US20060180860A1
公开(公告)日：2006-08-17
申请号：US11308330
申请日：2006-03-16
IPC分类号： H01L27/12
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An image sensor including an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer; the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.
摘要翻译： 提供了包括图像感测装置层，绝缘体上硅层（SOI）层，光学装置阵列和基板的图像传感器。 SOI层具有第一表面和第二表面。 图像感测装置层形成在SOI层的第一表面上。 光学器件阵列形成在SOI层的第二表面上。 衬底设置在SOI层的第二表面上方; 光学器件阵列设置在衬底和SOI层之间。 来自外部环境的入射光通过光学器件阵列和SOI层，并且由形成在图像感测器件层中的感测器件接收。 以这种方式，入射光的吸收或反射的概率降低。 因此，提高了本发明的图像传感器的感测性能和产量。
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公开(公告)号：US07060592B2
公开(公告)日：2006-06-13
申请号：US10711377
申请日：2004-09-15
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.
摘要翻译： 提供了包括图像感测装置层，绝缘体上硅（SOI）层，光学装置阵列和基板的图像传感器。 SOI层具有第一表面和第二表面。 图像感测装置层形成在SOI层的第一表面上。 光学器件阵列形成在SOI层的第二表面上。 衬底设置在SOI层的第二表面上方，并且光学器件阵列设置在衬底和SOI层之间。 来自外部环境的入射光通过光学器件阵列和SOI层，并且由形成在图像感测器件层中的感测器件接收。 以这种方式，入射光的吸收或反射的概率降低。 因此，提高了本发明的图像传感器的感测性能和产量。
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公开(公告)号：US07663693B2
公开(公告)日：2010-02-16
申请号：US10791410
申请日：2004-03-01
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L31/0203 , H01L2224/16225 , H04N2101/00 , H01L2224/48091 , H01L2924/00014
摘要： A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
摘要翻译： 提供相机模块。 相机模块包括：透镜; 具有下部的保持器，保持器保持透镜; 电路板; 以及图像感知和处理单元，其包括层叠在图像感测装置上并与其电连接的图像感测装置和可选的信号处理装置，所述图像感测处理单元被封装在所述电路板的一侧上; 其中，所述保持器固定在所述电路板上，所述图像感测处理单元位于所述保持器的下部内部。 此外，如果电路板是柔性电路板，则可以在对应于图像感测和处理单元的柔性PCB的另一侧上设置硬板，以增强机械强度。
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公开(公告)号：US20050190290A1
公开(公告)日：2005-09-01
申请号：US10791410
申请日：2004-03-01
IPC分类号： H01L27/00 , H01L27/146 , H01L31/0203 , H04N1/00 , H04N5/225
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L31/0203 , H01L2224/16225 , H04N2101/00 , H01L2224/48091 , H01L2924/00014
摘要： A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.
摘要翻译： 提供相机模块。 相机模块包括：透镜; 具有下部的保持器，保持器保持透镜; 电路板; 以及图像感知和处理单元，其包括层叠在图像感测装置上并与其电连接的图像感测装置和可选的信号处理装置，所述图像感测处理单元被封装在所述电路板的一侧上; 其中，所述保持器固定在所述电路板上，所述图像感测处理单元位于所述保持器的下部内部。 此外，如果电路板是柔性电路板，则可以在对应于图像感测和处理单元的柔性PCB的另一侧上设置硬板，以增强机械强度。
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