公开(公告)号：US20100045458A1

公开(公告)日：2010-02-25

申请号：US12193717

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G08B21/00

CPC分类号： B41F33/0036

摘要： The invention provides for a safety system for a measuring apparatus for measuring positions of integrated circuits on an integrated circuit carrier positioned, in use, in a working enclosure of the apparatus. The safety system includes a sensor arrangement for sensing an operational status of the measuring apparatus, and an emergency cut-off configured to deactivate the measuring apparatus automatically when an undesired operational status is sensed by the sensor arrangement. A control system is connected to the sensor arrangement and the emergency cut-off to activate the emergency cut-off on receipt of a predetermined signal from the sensor arrangement.

摘要翻译： 本发明提供了一种用于测量装置的安全系统，用于测量集成电路载体上的位置，所述集成电路载体位于使用中，位于设备的工作外壳中。 安全系统包括用于感测测量装置的操作状态的传感器装置，以及配置成当传感器装置感测不期望的操作状态时自动停用测量装置的紧急切断装置。 控制系统连接到传感器装置和紧急切断器，以在接收到来自传感器装置的预定信号时启动紧急切断。

公开(公告)号：US20110149355A1

公开(公告)日：2011-06-23

申请号：US13037155

申请日：2011-02-28

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： H04N1/04

CPC分类号： G03G15/101

摘要： The invention provides for an imaging apparatus for imaging an integrated circuit carrier and respective integrated circuits mounted on the integrated circuit carrier. The imaging apparatus has a support structure and a bed mounted on the support structure. The bed is displaceable along a horizontal axis. A nest assembly is supported by the bed, and retains the integrated circuit carrier and respective integrated circuits. An image recordal device is provided for recording an image representing the integrated circuit carrier and integrated circuits. A support assembly is attached to the support structure. The support assembly supports the image recordal device, and is adjustable to enable adjustment of a position of the image recordal device relative to the bed.

摘要翻译： 本发明提供了一种用于对集成电路载体和安装在集成电路载体上的各个集成电路进行成像的成像装置。 成像装置具有支撑结构和安装在支撑结构上的床。 床沿水平轴移动。 巢组件由床支撑，并且保持集成电路载体和相应的集成电路。 提供了一种用于记录表示集成电路载体和集成电路的图像的图像记录装置。 支撑组件附接到支撑结构。 支撑组件支撑图像记录装置，并且是可调节的，以能够调整图像记录装置相对于床的位置。

公开(公告)号：US20100046007A1

公开(公告)日：2010-02-25

申请号：US12193718

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G01B11/14

CPC分类号： B41J2/1635 ,  B41J2/1639 ,  B41J2202/19

摘要： The invention relates to a measuring apparatus. The apparatus includes a housing assembly that defines an enclosure, a control system mounted in the housing assembly, and an operator interface mounted on the housing assembly and connected to the control system to allow an operator to control the measuring apparatus. The apparatus also includes a measuring table assembly mounted in the housing assembly and configured to receive a nest assembly supporting an integrated circuit carrier carrying a number of integrated circuits, and a camera assembly mounted in the housing assembly and configured to generate image data representing the integrated circuit carrier and the integrated circuits. The camera assembly is connected to the control system which is configured to carry out a positional analysis on the integrated circuit carrier and the integrated circuits to determine at least one of positions of the integrated circuits on the carrier and relative positions of consecutive integrated circuits.

摘要翻译： 本发明涉及一种测量装置。 该装置包括限定外壳的壳体组件，安装在壳体组件中的控制系统以及安装在壳体组件上并连接到控制系统以允许操作者控制测量装置的操作者界面。 该装置还包括安装在壳体组件中并被配置为接收支撑携带多个集成电路的集成电路载体的嵌套组件的测量台组件，以及安装在壳体组件中并被配置为生成表示集成的图像数据的图像数据 电路载体和集成电路。 相机组件连接到控制系统，其被配置为对集成电路载体和集成电路执行位置分析，以确定载体上的集成电路的位置和连续集成电路的相对位置中的至少一个。

公开(公告)号：US07924440B2

公开(公告)日：2011-04-12

申请号：US12193719

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G01B11/14

CPC分类号： G03G15/101

摘要： The invention provides for an imaging apparatus for imaging integrated circuits and a respective integrated circuit carrier. This enables positional analysis to be carried out on the integrated circuits and respective carrier. The imaging apparatus includes a support structure, and a bed mounted on the support structure and displaceable along an operatively horizontal axis, the bed being configured to support a nest assembly that operatively retains the integrated circuit carrier and respective integrated circuits. Also included is a support assembly operatively mountable with respect to a bed on which the integrated circuit carrier and integrated circuits are supported, in use. The apparatus further includes an image recordal device mounted on the support assembly and configured to record an image representing the integrated circuit carrier and integrated circuits, the support assembly including an adjustment mechanism to enable adjustment of a position of the image recordal device relative to the bed.

摘要翻译： 本发明提供了一种用于对集成电路进行成像和相应的集成电路载体的成像装置。 这使得能够在集成电路和相应载体上进行位置分析。 成像设备包括支撑结构和安装在支撑结构上并可沿着可操作的水平轴线移位的床，床被配置为支撑可操作地保持集成电路载体和相应集成电路的嵌套组件。 还包括在使用中相对于床上集成电路载体和集成电路支撑的可操作地安装的支撑组件。 所述装置还包括安装在所述支撑组件上并被配置为记录表示所述集成电路载体和集成电路的图像的图像记录装置，所述支撑组件包括调节机构，以能够调整所述图像记录装置相对于所述床的位置 。

公开(公告)号：US20100044437A1

公开(公告)日：2010-02-25

申请号：US12193715

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G06K7/10

CPC分类号： B41J2/515 ,  B41J2/155 ,  B41J2/45 ,  B41J2202/19 ,  B41J2202/20

摘要： The invention provides for a measuring apparatus for measuring the positions of a plurality of printhead integrated circuits relative to a carrier on which the printhead integrated circuits are located. The carrier has carrier fiducials and each integrated circuit has integrated circuit fiducials. The measuring apparatus includes a support assembly, a receptacle positioned on the support assembly and configured to receive the carrier, the receptacle being movable relative to the support assembly between a loading position and a sensing position, and a sensor configured to sense positions of the carrier and integrated circuit fiducials. The apparatus also includes a control system configured to control the sensor to measure the positions of the carrier and integrated circuit fiducials.

摘要翻译： 本发明提供一种用于测量多个打印头集成电路相对于打印头集成电路所在的载体的位置的测量装置。 载波具有载波基准，每个集成电路具有集成电路基准。 所述测量装置包括支撑组件，位于所述支撑组件上并被配置为容纳所述托架的插座，所述插座可相对于所述支撑组件在装载位置和感测位置之间移动，以及传感器，所述传感器构造成感测所述载体的位置 和集成电路基准。 该装置还包括配置成控制传感器以测量载体和集成电路基准的位置的控制系统。

公开(公告)号：US07880900B2

公开(公告)日：2011-02-01

申请号：US12193718

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G01B11/14

CPC分类号： B41J2/1635 ,  B41J2/1639 ,  B41J2202/19

摘要： The invention relates to a measuring apparatus. The apparatus includes a housing assembly that defines an enclosure, a control system mounted in the housing assembly, and an operator interface mounted on the housing assembly and connected to the control system to allow an operator to control the measuring apparatus. The apparatus also includes a measuring table assembly mounted in the housing assembly and configured to receive a nest assembly supporting an integrated circuit carrier carrying a number of integrated circuits, and a camera assembly mounted in the housing assembly and configured to generate image data representing the integrated circuit carrier and the integrated circuits. The camera assembly is connected to the control system which is configured to carry out a positional analysis on the integrated circuit carrier and the integrated circuits to determine at least one of positions of the integrated circuits on the carrier and relative positions of consecutive integrated circuits.

摘要翻译： 本发明涉及一种测量装置。 该装置包括限定外壳的壳体组件，安装在壳体组件中的控制系统以及安装在壳体组件上并连接到控制系统以允许操作者控制测量装置的操作者界面。 该装置还包括安装在壳体组件中并被配置为接收支撑携带多个集成电路的集成电路载体的嵌套组件的测量台组件，以及安装在壳体组件中并被配置为生成表示集成的图像数据的图像数据 电路载体和集成电路。 相机组件连接到控制系统，其被配置为对集成电路载体和集成电路执行位置分析，以确定载体上的集成电路的位置和连续集成电路的相对位置中的至少一个。

公开(公告)号：US20100045986A1

公开(公告)日：2010-02-25

申请号：US12193719

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： G03G21/00

CPC分类号： G03G15/101

摘要： The invention provides for an imaging apparatus for imaging integrated circuits and a respective integrated circuit carrier. This enables positional analysis to be carried out on the integrated circuits and respective carrier. The imaging apparatus includes a support structure, and a bed mounted on the support structure and displaceable along an operatively horizontal axis, the bed being configured to support a nest assembly that operatively retains the integrated circuit carrier and respective integrated circuits. Also included is a support assembly operatively mountable with respect to a bed on which the integrated circuit carrier and integrated circuits are supported, in use. The apparatus further includes an image recordal device mounted on the support assembly and configured to record an image representing the integrated circuit carrier and integrated circuits, the support assembly including an adjustment mechanism to enable adjustment of a position of the image recordal device relative to the bed.

摘要翻译： 本发明提供了一种用于对集成电路进行成像和相应的集成电路载体的成像装置。 这使得能够在集成电路和相应载体上进行位置分析。 成像设备包括支撑结构和安装在支撑结构上并可沿着可操作的水平轴线移位的床，床被配置为支撑可操作地保持集成电路载体和相应集成电路的嵌套组件。 还包括在使用中相对于床上集成电路载体和集成电路支撑的可操作地安装的支撑组件。 所述装置还包括安装在所述支撑组件上并被配置为记录表示所述集成电路载体和集成电路的图像的图像记录装置，所述支撑组件包括调节机构，以能够调整所述图像记录装置相对于所述床的位置 。

公开(公告)号：US20100045729A1

公开(公告)日：2010-02-25

申请号：US12193716

申请日：2008-08-19

申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

IPC分类号： B41J29/393

CPC分类号： B41J29/393 ,  B41J29/02

摘要： The invention relates to a method for testing an alignment of a carrier with respect to a plurality of integrated circuits on the carrier. The carrier has optically discernible carrier references and each integrated circuit has optically discernible circuit references. The method includes the steps of receiving the carrier in a holding assembly, sensing positions of the carrier and circuit references, and measuring the positions of the carrier and circuit references

摘要翻译： 本发明涉及一种用于测试载体相对于载体上的多个集成电路的对准的方法。 载波具有光学可辨别的载波参考，并且每个集成电路具有光学可辨别的电路参考。 该方法包括以下步骤：在保持组件中接收载体，感测载体和电路基准的位置，以及测量载体和电路基准的位置

公开(公告)号：US20100043980A1

公开(公告)日：2010-02-25

申请号：US12193733

申请日：2008-08-19

申请人： Stephen John Sleijpen ,  James Andrew ,  Graeme Kenneth Bowyer ,  William Granger ,  Jan Waszczuk ,  David Oliver Burke ,  Craig Donald Strudwicke ,  Jason Mark Thelander

发明人： Stephen John Sleijpen ,  James Andrew ,  Graeme Kenneth Bowyer ,  William Granger ,  Jan Waszczuk ,  David Oliver Burke ,  Craig Donald Strudwicke ,  Jason Mark Thelander

IPC分类号： B32B37/00

CPC分类号： B32B38/1841 ,  B26D7/086 ,  B26D7/27 ,  B32B38/0004 ,  B32B41/00 ,  B32B2310/028 ,  B32B2457/08 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is an alignment mechanism for aligning a lamination film with a carrier substructure prior to laminating the film to the substructure to form a carrier for integrated circuits. The substructure and the lamination film define complementary perforations and a plurality of respective fiducials. The alignment mechanism includes a sensor arrangement configured to detect the fiducials in the lamination film and substructure and a displacement mechanism configured to displace the lamination film with respect to the substructure to align the perforations of the film and substructure respectively according to alignment of their fiducials so that a printing fluid can pass through the perforations in the film and the substructure of the carrier. The mechanism also includes a controller configured to control operation of the sensor arrangement and the displacement mechanism.

摘要翻译： 提供了一种用于在将膜层压到子结构之前将层压膜与载体子结构对准的对准机构，以形成用于集成电路的载体。 子结构和层压膜限定互补的穿孔和多个相应的基准。 对准机构包括：传感器装置，被配置为检测层压薄膜和底层结构中的基准;以及位移机构，其构造成相对于子结构移动层压膜，以分别根据其基准的对准来对准薄膜和子结构的穿孔，从而 印刷液体可以穿过胶片中的穿孔和载体的底层结构。 该机构还包括控制器，其被配置为控制传感器装置和位移机构的操作。

公开(公告)号：US20100043979A1

公开(公告)日：2010-02-25

申请号：US12193732

申请日：2008-08-19

申请人： Stephen John Sleijpen ,  James Andrew ,  Graeme Kenneth Bowyer ,  William Granger ,  Jan Waszczuk ,  David Oliver Burke ,  Craig Donald Strudwicke ,  Jason Mark Thelander

发明人： Stephen John Sleijpen ,  James Andrew ,  Graeme Kenneth Bowyer ,  William Granger ,  Jan Waszczuk ,  David Oliver Burke ,  Craig Donald Strudwicke ,  Jason Mark Thelander

IPC分类号： B32B37/00

CPC分类号： B32B37/26 ,  B26D7/086 ,  B26D7/27 ,  B32B37/0046 ,  B32B38/0004 ,  B32B41/00 ,  B32B2037/268 ,  B32B2310/028 ,  B32B2457/08 ,  Y10T156/17

摘要： The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.

摘要翻译： 本发明涉及一种用于将用于承载打印头集成电路的载体片材接合到载体基底的粘合装置。 该装置包括构造成接收和支撑载体基座的支撑组件和布置在支撑组件上并被构造成将载体片材结合到载体基座上的层压头。 进一步包括的是保形材料供应机构，其布置在支撑组件上并且构造成在结合之前在表面和头部之间插入共形材料;以及控制器，用于控制层压头和供应机构的操作以便于承载器 工作台到承运人基地。