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    Integrated circuit placement system
    1.
    发明授权
    Integrated circuit placement system 有权
    集成电路放置系统

    公开(公告)号：US08092625B2

    公开(公告)日：2012-01-10

    申请号：US12193745

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    IPC分类号： B32B41/00

    CPC分类号： H01L21/6838 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

    摘要翻译： 本发明涉及一种用于将骰子放置在载体上的骰子放置组件。 该组件包括具有夹持机构的支撑平台，该夹持机构构造成将载体夹紧到所述平台上，以及操作性地指向平台的至少一个相机，以检测载体上的对准基准。 组件还包括具有真空机构的放置装置，用于从供给机构中取出骰子，所述放置装置具有致动器，以将骰子与载体对准，并将骰子放置在其上一次对齐，以及加热器以在骰子之前加热骰子 放置在试验台上。 还包括控制器，可操作地控制夹紧机构，相机和放置装置，以便于将骰子准确地放置在载体上。

    Leak tester for a carrier for printhead integrated circuitry
    2.
    发明授权
    Leak tester for a carrier for printhead integrated circuitry 有权
    用于打印头集成电路的载体的泄漏测试仪

    公开(公告)号：US07971472B2

    公开(公告)日：2011-07-05

    申请号：US12193725

    申请日：2008-08-19

    申请人： Stephen John Sleijpen ,  Joseph Tharion ,  Jan Waszczuk ,  Eric Patrick O'Donnell ,  William Granger ,  David Bernardi ,  Stephen Richard O'Farrell ,  Jason Mark Thelander

    发明人： Stephen John Sleijpen ,  Joseph Tharion ,  Jan Waszczuk ,  Eric Patrick O'Donnell ,  William Granger ,  David Bernardi ,  Stephen Richard O'Farrell ,  Jason Mark Thelander

    IPC分类号： G01M3/26

    CPC分类号： G01M3/26

    摘要： Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner. The tester also includes a pressure measurement arrangement operatively arranged with respect to the pressurized fluid supply to measure pressure applied at the fluid inlets, and a controller operatively connected to the pressure measurement arrangement and pressurized fluid supply, the controller being configured to control the fluid supply to charge the carrier with pressurized fluid until a predetermined pressure is reached, and to monitor the pressure for a predetermined period of time.

    摘要翻译： 提供了用于打印头集成电路的载体的泄漏测试器。 载体具有至少一个流体入口，其通过离散流体路径与多个流体出口流体连通。 该测试器包括支撑组件，该支撑组件包括至少一个成形并构造成容纳至少一个相应载体的容器以及布置在支撑组件上并被配置成将加压流体供应到流体入口的加压流体供给装置， 密封机构构造成以密封方式接合流体入口。 测试仪还包括压力测量装置，其相对于加压流体供应可操作地设置以测量在流体入口处施加的压力，以及可操作地连接到压力测量装置和加压流体供应的控制器，该控制器构造成控制流体供应 用加压流体对载体进行充电，直到达到预定压力，并且在一段预定的时间段内监测压力。

    INTEGRATED CIRCUIT PLACEMENT SYSTEM
    4.
    发明申请
    INTEGRATED CIRCUIT PLACEMENT SYSTEM 有权
    集成电路放置系统

    公开(公告)号：US20100047043A1

    公开(公告)日：2010-02-25

    申请号：US12193745

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell ,  Peter John Morley Sobey

    IPC分类号： H01L21/67

    CPC分类号： H01L21/6838 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

    摘要翻译： 本发明涉及一种用于将骰子放置在载体上的骰子放置组件。 该组件包括具有夹持机构的支撑平台，该夹持机构构造成将载体夹紧到所述平台上，以及操作性地指向平台的至少一个相机，以检测载体上的对准基准。 组件还包括具有真空机构的放置装置，用于从供给机构中取出骰子，所述放置装置具有致动器，以将骰子与载体对准，并将骰子放置在其上一次对齐，以及加热器以在骰子之前加热骰子 放置在试验台上。 还包括控制器，可操作地控制夹紧机构，相机和放置装置，以便于将骰子准确地放置在载体上。

    SAFETY SYSTEM FOR AN INTEGRATED CIRCUIT ALIGNMENT TESTING APPARATUS
    5.
    发明申请
    SAFETY SYSTEM FOR AN INTEGRATED CIRCUIT ALIGNMENT TESTING APPARATUS 审中-公开
    集成电路对准测试装置的安全系统

    公开(公告)号：US20100045458A1

    公开(公告)日：2010-02-25

    申请号：US12193717

    申请日：2008-08-19

    申请人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

    发明人： Joseph Tharion ,  William Granger ,  Ralph Lewis Ranger ,  Graeme Kenneth Bowyer ,  Jason Mark Thelander

    IPC分类号： G08B21/00

    CPC分类号： B41F33/0036

    摘要： The invention provides for a safety system for a measuring apparatus for measuring positions of integrated circuits on an integrated circuit carrier positioned, in use, in a working enclosure of the apparatus. The safety system includes a sensor arrangement for sensing an operational status of the measuring apparatus, and an emergency cut-off configured to deactivate the measuring apparatus automatically when an undesired operational status is sensed by the sensor arrangement. A control system is connected to the sensor arrangement and the emergency cut-off to activate the emergency cut-off on receipt of a predetermined signal from the sensor arrangement.

    摘要翻译： 本发明提供了一种用于测量装置的安全系统，用于测量集成电路载体上的位置，所述集成电路载体位于使用中，位于设备的工作外壳中。 安全系统包括用于感测测量装置的操作状态的传感器装置，以及配置成当传感器装置感测不期望的操作状态时自动停用测量装置的紧急切断装置。 控制系统连接到传感器装置和紧急切断器，以在接收到来自传感器装置的预定信号时启动紧急切断。

    PRINTED CIRCUIT BOARD BONDING DEVICE
    8.
    发明申请
    PRINTED CIRCUIT BOARD BONDING DEVICE 有权
    印刷电路板接合装置

    公开(公告)号：US20100043212A1

    公开(公告)日：2010-02-25

    申请号：US12193734

    申请日：2008-08-19

    申请人： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

    发明人： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

    IPC分类号： H05K13/04

    CPC分类号： H05K3/361 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2203/0278 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/5313 ,  Y10T29/53174

    摘要： The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

    摘要翻译： 本发明涉及一种用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置。 打印头组件包括打印头托架和由托架承载的喷墨打印头。 接合装置包括支撑结构组件和布置在支撑结构组件上的第一加热器组件，以可沿着第一路径移动并且构造成将柔性PCB结合到打印头。 弯曲机构布置在支撑结构上，并被构造成弯曲粘合的PCB。 第二加热器组件布置在支撑结构组件上以可沿着第二路径移动并且被配置为将弯曲的PCB接合到打印头托架。 控制系统控制加热器组件和弯曲机构的操作。

    Wafer positioning system
    9.
    发明授权
    Wafer positioning system 有权
    晶圆定位系统

    公开(公告)号：US08296937B2

    公开(公告)日：2012-10-30

    申请号：US12193748

    申请日：2008-08-19

    申请人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    发明人： David Oliver Burke ,  Jan Waszczuk ,  Desmond Bruce Boyton ,  Craig Donald Strudwicke ,  Peter John Morley Sobey ,  William Granger ,  Jason Mark Thelander ,  Eric Patrick O'Donnell

    IPC分类号： B23P19/00

    CPC分类号： H01L21/67144 ,  H01L21/68 ,  Y10T29/53174 ,  Y10T29/53265

    摘要： The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.

    摘要翻译： 本发明提供一种汇编器，用于通过在每个IC上具有曲折墨水供应路径的载体上组装喷墨IC来构造页宽喷墨打印头。 汇编器支持并定位具有喷墨IC的切割晶片，并且从晶片拾取和传送预定的多个IC以顺序放置在载体上，从而构成页宽打印头。 组装件的管芯放置组件接收夹具组件的细长主体，其具有一对或细长的保持板，板下方的插入件以及容纳承载件并可气动移位以将插入件推靠在板上的隔膜。 装配器的晶片定位组件的基板/板具有阶段，其中一个可旋转地安装支撑板，该支撑板接收晶片并且具有在组装器的控制器的控制下使支撑板在组装器的模具选择器下旋转的电动机。

    PRINTED CIRCUIT BOARD BONDING DEVICE
    10.
    发明申请
    PRINTED CIRCUIT BOARD BONDING DEVICE 审中-公开
    印刷电路板接合装置

    公开(公告)号：US20120006494A1

    公开(公告)日：2012-01-12

    申请号：US13220630

    申请日：2011-08-29

    申请人： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

    发明人： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

    IPC分类号： B29C65/48

    CPC分类号： H05K3/361 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2203/0278 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/5313 ,  Y10T29/53174

    摘要： A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.

    摘要翻译： 用于将柔性印刷电路板（PCB）接合到打印头组件的接合装置包括封闭的工作区域; 第一加热器组件，设置在封闭的工作区域内并沿第一路径移动; 弯曲机构，其设置在所述封闭的工作区域内并适于弯曲所述粘合的PCB; 第二加热器组件，其设置在所述封闭的工作区域内并沿着第二路径移动; 用于接收打印头组件的嵌套结构，所述嵌套结构可沿着第三路径移动; 以及用于控制加热器组件的操作的控制系统，弯曲机构和嵌套结构。 第一路径和第二路径被限制在封闭的工作区域内的区域，并且第三路径穿过封闭的工作区域的边界。