公开(公告)号：US06974069B2

公开(公告)日：2005-12-13

申请号：US10465632

申请日：2003-06-20

申请人： Ju-il Kang ,  Hee-Sang Yang

发明人： Ju-il Kang ,  Hee-Sang Yang

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/08 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/00

摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

摘要翻译： 本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。 例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。 在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。 在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。 为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。

公开(公告)号：US06607117B1

公开(公告)日：2003-08-19

申请号：US09690683

申请日：2000-10-16

申请人： Ju-Il Kang ,  Hee-Sang Yang

发明人： Ju-Il Kang ,  Hee-Sang Yang

IPC分类号： B23K100

CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/08 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/00

摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

摘要翻译： 本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。 例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。 在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。 在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。 为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。

公开(公告)号：US08317015B2

公开(公告)日：2012-11-27

申请号：US12825160

申请日：2010-06-28

申请人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

发明人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

IPC分类号： B65D55/02

CPC分类号： H01L21/6734

摘要： A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

摘要翻译： 用于锁定构造成接收印刷电路板（PCB）的盒的锁定装置可以包括致动器，旋转块和锁定构件。 执行器可以安装在刀库上。 旋转块可以连接到致动器。 旋转块可绕垂直轴旋转。 锁定构件可以围绕垂直轴线可旋转地连接到盒。 可以将锁定构件选择性地与旋转块组合以阻挡盒的前面，从而防止PCB从盒中脱离。

公开(公告)号：US08132305B2

公开(公告)日：2012-03-13

申请号：US11848152

申请日：2007-08-30

申请人： Tai-Kew Choi ,  Yong-Kyun Sun ,  Hee-Sang Yang ,  Yo-Se Eum ,  Ho-Soo Jang

发明人： Tai-Kew Choi ,  Yong-Kyun Sun ,  Hee-Sang Yang ,  Yo-Se Eum ,  Ho-Soo Jang

IPC分类号： B23P23/00 ,  B23C1/08 ,  B23C5/10 ,  B23C5/12

CPC分类号： B23B39/161 ,  Y10T29/5196 ,  Y10T407/1948 ,  Y10T407/196 ,  Y10T408/03 ,  Y10T408/3844 ,  Y10T409/304144 ,  Y10T409/305264 ,  Y10T409/30532 ,  Y10T409/307168 ,  Y10T409/308064 ,  Y10T409/308288 ,  Y10T409/30868

摘要： A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

摘要翻译： 包装切割装置包括安装在锯切机器人处的至少两个锭子，并使用切割刀将包括多个包装的框架切割成包装; 装载框架的框架装载夹具，使得框架被切割; 以及安装在正交机器人处的框架和单元拾取器，用于将框架装载和卸载框架装载夹具，其中检查安装在主轴处的切割钻头的状态。

公开(公告)号：US20110042242A1

公开(公告)日：2011-02-24

申请号：US12825160

申请日：2010-06-28

申请人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

发明人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

IPC分类号： B65D55/02

CPC分类号： H01L21/6734

摘要： A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

摘要翻译： 用于锁定构造成接收印刷电路板（PCB）的盒的锁定装置可以包括致动器，旋转块和锁定构件。 执行器可以安装在刀库上。 旋转块可以连接到致动器。 旋转块可绕垂直轴旋转。 锁定构件可以围绕垂直轴线可旋转地连接到盒。 可以将锁定构件选择性地与旋转块组合以阻挡盒的前面，从而防止PCB从盒中脱离。