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    DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE
    1.
    发明申请
    DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE 审中-公开
    用于制造半导体器件的封装检测装置

    公开(公告)号：US20080090311A1

    公开(公告)日：2008-04-17

    申请号：US11858284

    申请日：2007-09-20

    申请人： Dong-joo ROH ,  Yong-kyun SUN ,  Youn-sung KO

    发明人： Dong-joo ROH ,  Yong-kyun SUN ,  Youn-sung KO

    IPC分类号： H01L21/66 ,  C23C16/00

    CPC分类号： B23K1/08 ,  B23K2101/40

    摘要： A dipping detecting device used in the fabrication of semiconductor devices. The dipping detecting device includes a gripper used as a conductive first electrode and configured to pick up a semiconductor device in order to dip the semiconductor device into a dipping solution. A conductor used as a second electrode and formed at a side of the gripper. The conductor electrically insulated from the gripper. A power source unit applying a power to the gripper and the conductor and detecting a current flow, wherein a dipping state of the semiconductor device is detected depending on the flow of current.

    摘要翻译： 用于制造半导体器件的浸渍检测装置。 浸渍检测装置包括用作导电第一电极并构造成拾取半导体器件以将半导体器件浸入浸渍溶液中的夹持器。 用作第二电极并形成在夹持器一侧的导体。 导体与夹具电绝缘。 电源单元，对所述夹持器和所述导体施加电力，并检测电流，其中根据所述电流流动来检测所述半导体器件的浸渍状态。

    Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
    3.
    发明授权
    Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation 失效
    具有洗涤液喷雾和抽吸装置的晶片锯切装置用于碎屑去除和散热

    公开(公告)号：US6105567A

    公开(公告)日：2000-08-22

    申请号：US19121

    申请日：1998-02-05

    申请人： Yong Kyun Sun ,  Sam Bok Jang ,  Dong Sung Jang

    发明人： Yong Kyun Sun ,  Sam Bok Jang ,  Dong Sung Jang

    IPC分类号： B28D7/02 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  B28D1/04

    CPC分类号： B28D5/0076 ,  H01L21/78

    摘要： A wafer sawing apparatus scribes a wafer having a plurality of ICs which are separated from each other by a plurality of scribe streets so as to cut the wafer into individual ICs. During scribing, silicon particles are produced and heat is generated as the scribing blade abrades the wafer surface. These silicon particles may remain on the surface of the ICs and cause defects in later manufacturing processes. Therefore, the wafer sawing apparatus has two side nozzles, one positioned on each side of the scribing blade to spray a washing solution onto the scribing blade and a top surface of the wafer through an arc having a designated angle, and a center nozzle which is positioned adjacent to and ahead of a cutting edge of the scribing blade in the driving direction, which also sprays the washing solution onto the scribing blade and the top surface of the wafer at a designated downward angle. The wafer sawing apparatus is also equipped with a suction device for suctioning the silicon particles from the top surface of the wafer, at the point where the particles are produced from the wafer by the scribing blade.

    摘要翻译： 晶片锯切装置对具有多个IC的晶片进行划片，该多个IC通过多个刻划街道彼此分离，从而将晶片切割成各自的IC。 在划线期间，产生硅颗粒，并且随着划线刀片磨损晶片表面而产生热量。 这些硅颗粒可以保留在IC的表面上，并在后来的制造工艺中引起缺陷。 因此，晶片锯切装置具有两个侧喷嘴，一个位于划线刀片的每一侧上，一侧通过具有指定角度的电弧将洗涤溶液喷射到划线刀片和晶片的上表面上，该中心喷嘴是 定位在划线刀片的驱动方向上的切割边缘附近和之前，其也以指定的向下角度将洗涤溶液喷射到划线刀片和晶片的顶表面上。 晶片锯切装置还配备有用于从晶片的顶表面吸引硅颗粒的抽吸装置，其中通过划线刀片从晶片产生颗粒。

    Die attaching apparatus
    5.
    发明授权
    Die attaching apparatus 失效
    模具附着装置

    公开(公告)号：US07650687B2

    公开(公告)日：2010-01-26

    申请号：US11155181

    申请日：2005-06-16

    申请人： Jung-Hwan Woo ,  Ho-Jae Byon ,  Jae-Bong Shin ,  Yong-Kyun Sun ,  Hyun-Ho Kim ,  Choo-Ho Kim ,  Youn-Sung Ko

    发明人： Jung-Hwan Woo ,  Ho-Jae Byon ,  Jae-Bong Shin ,  Yong-Kyun Sun ,  Hyun-Ho Kim ,  Choo-Ho Kim ,  Youn-Sung Ko

    IPC分类号： B23P19/00 ,  B21F1/00

    CPC分类号： H01L21/67144 ,  H01L21/67092 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53239

    摘要： Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

    摘要翻译： 提供了一种模具附接装置，清洁系统和方法，其具有能够在短时间内容易地替换适用于各种包装的新的部件。 防止模压构件和加热板的表面被污染。 模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。 其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。 加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。

    System for testing memory modules using a rotating-type module mounting portion
    6.
    发明授权
    System for testing memory modules using a rotating-type module mounting portion 有权
    使用旋转式模块安装部分测试内存模块的系统

    公开(公告)号：US07602171B2

    公开(公告)日：2009-10-13

    申请号：US11518981

    申请日：2006-09-12

    申请人： Sun Choi ,  Dong-soo Lee ,  Yong-kyun Sun ,  Hyun-ho Kim

    发明人： Sun Choi ,  Dong-soo Lee ,  Yong-kyun Sun ,  Hyun-ho Kim

    IPC分类号： G01R31/28 ,  G11C29/00

    CPC分类号： G11C29/56 ,  G01R31/2808 ,  G11C5/04 ,  G11C29/56016

    摘要： A system for testing memory modules having a rotating-type board mounting portion with a plurality of mounting surfaces positioned at different planes and connected around an axis to form a rotatable structure, at least one circuit board mounted on each mounting surface, an input/output portion, a rotational motor coupled to a rotational shaft for rotating the rotatable structure, and a central controller electrically connected to the circuit boards.

    摘要翻译： 一种用于测试具有旋转型板安装部分的存储器模块的系统，其具有位于不同平面上的多个安装表面并且围绕轴线连接以形成可旋转结构，安装在每个安装表面上的至少一个电路板，输入/输出 耦合到用于旋转可旋转结构的旋转轴的旋转电机，以及电连接到电路板的中央控制器。

    Sawing and sorting system
    9.
    发明申请
    Sawing and sorting system 审中-公开
    锯切和分拣系统

    公开(公告)号：US20060056955A1

    公开(公告)日：2006-03-16

    申请号：US11220784

    申请日：2005-09-06

    申请人： Yong-Kuk Kim ,  Hyun-Ho Kim ,  Ho-Seong Kim ,  Yong-Kyun Sun ,  Tai-Kew Choi

    发明人： Yong-Kuk Kim ,  Hyun-Ho Kim ,  Ho-Seong Kim ,  Yong-Kyun Sun ,  Tai-Kew Choi

    IPC分类号： B65H1/00

    CPC分类号： B28D5/0082 ,  B28D5/029

    摘要： A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.

    摘要翻译： 锯切和分拣系统结合了锯切设备和分拣设备。 锯切和分拣系统包括一个装载机。 装载机包括容纳多个条带的盒。 安装单元将条带安装在其上。 多个传送和锯切机器人均包括拾取单元。 拾取单元包括可旋转卡盘台。 传送和锯切机器人水平和垂直地传送拾取器单元。 可转动的卡盘支承带。 拾取器单元旋转可旋转卡盘台。 多个锯切主轴单元各自包括旋转叶片。 锯切主轴单元水平移动刀片，将刀片分割成单元包装。 清洁单元清洁单元包装。 测试装置根据测试标准检查单元包装。 分拣表安装单元包装进行排序。 卸载机提供托盘。 排序传送机器人将单元包装分类到托盘中。

    Apparatus for testing a semiconductor module
    10.
    发明申请
    Apparatus for testing a semiconductor module 审中-公开
    用于测试半导体模块的装置

    公开(公告)号：US20070138466A1

    公开(公告)日：2007-06-21

    申请号：US11604822

    申请日：2006-11-28

    申请人： Dong-Soo Lee ,  Seon-O Kim ,  Yong-Kyun Sun ,  Hyo-Gyu Kim

    发明人： Dong-Soo Lee ,  Seon-O Kim ,  Yong-Kyun Sun ,  Hyo-Gyu Kim

    IPC分类号： H01L23/58

    CPC分类号： H01L21/67766 ,  G01R31/2893 ,  H01L21/673 ,  H01L21/67769

    摘要： An apparatus for testing a semiconductor module may include a test shelf, test modules and a transfer robot. The test shelf may include multilayered test cells in which a plurality of test cells may be arranged in each of a plurality of layers. The test modules may be each provided in the test cells. The transfer robot may insert the semiconductor module into the test module. The transfer robot may separate the semiconductor module from the test module.

    摘要翻译： 用于测试半导体模块的装置可以包括测试架，测试模块和传送机器人。 测试架可以包括其中多个测试单元可以布置在多个层中的每一层中的多层测试单元。 测试模块可以分别设置在测试单元中。 传送机器人可将半导体模块插入测试模块。 传送机器人可以将半导体模块与测试模块分离。