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    METHOD AND APPARATUS FOR REDUCING DOWN TIME OF A LITHOGRAPHY SYSTEM
    1.
    发明申请
    METHOD AND APPARATUS FOR REDUCING DOWN TIME OF A LITHOGRAPHY SYSTEM 有权
    降低刻蚀系统下降时间的方法和装置

    公开(公告)号：US20100321660A1

    公开(公告)日：2010-12-23

    申请号：US12486565

    申请日：2009-06-17

    申请人： Jui-Chun Peng ,  Heng-Jen Lee ,  Tung-Li Wu ,  I-Hsiung Huang

    发明人： Jui-Chun Peng ,  Heng-Jen Lee ,  Tung-Li Wu ,  I-Hsiung Huang

    IPC分类号： G03B27/54

    CPC分类号： G03B27/54 ,  G03F7/70033 ,  G03F7/70916 ,  H05G2/005 ,  H05G2/008

    摘要： An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.

    摘要翻译： 一种装置包括辐射源，辐射源发射基本上所有的一定量物质蒸发的辐射束; 以及具有第一和第二表面部分的结构，第一操作模式，其中更大量的蒸发副产物撞击在第一表面部分上，以及第二操作模式，其中较大量的副产物撞击在第二表面部分上。 不同的方面涉及朝向一定数量的材料发射辐射束，所述辐射束导致基本上所有量的材料蒸发; 在第一操作模式中操作具有第一和第二表面部分的结构，其中更大量的蒸发副产物撞击在第一表面部分上; 然后以第二操作模式操作该结构，其中较大量的副产物撞击在第二表面部分上。

    Dual wavelength exposure method and system for semiconductor device manufacturing
    2.
    发明授权
    Dual wavelength exposure method and system for semiconductor device manufacturing 有权
    双波长曝光方法和半导体器件制造系统

    公开(公告)号：US08338262B2

    公开(公告)日：2012-12-25

    申请号：US12478426

    申请日：2009-06-04

    申请人： Heng-Jen Lee ,  Jui-Chun Peng ,  I-Hsiung Huang

    发明人： Heng-Jen Lee ,  Jui-Chun Peng ,  I-Hsiung Huang

    IPC分类号： H01L21/336

    CPC分类号： G03F7/203 ,  G03F7/7045 ,  G03F7/70458 ,  G03F7/70466

    摘要： A dual wavelength exposure system provides for patterning a resist layer formed on a wafer for forming semiconductor devices, using two exposure operations, one including a first radiation having a first wavelength and the other including a second radiation including a second wavelength. Different or the same lithography tool may be used to generate the first and second radiation. For each die formed on the semiconductor device, a critical portion of the pattern is exposed using a first exposure operation that uses a first radiation with a first wavelength and a non-critical portion of the pattern is exposed using a second exposure operation utilizing the second radiation at a second wavelength. The resist material is chosen to be sensitive to both the first radiation having a first wavelength and the second radiation having the second wavelength.

    摘要翻译： 双波长曝光系统提供了使用两个曝光操作来形成在晶片上形成的晶片上的抗蚀剂层，一个包括具有第一波长的第一辐射，另一个包括包括第二波长的第二辐射。 可以使用不同或相同的光刻工具来产生第一和第二辐射。 对于形成在半导体器件上的每个裸片，使用第一曝光操作曝光图案的关键部分，该第一曝光操作使用第一波长的第一辐射，并且使用第二曝光操作曝光图案的非关键部分 第二波长的辐射。 抗蚀剂材料被选择为对具有第一波长的第一辐射和具有第二波长的第二辐射都敏感。

    In-situ immersion hood cleaning
    3.
    发明授权
    In-situ immersion hood cleaning 有权

    公开(公告)号：US09632426B2

    公开(公告)日：2017-04-25

    申请号：US13008605

    申请日：2011-01-18

    申请人： Jui-Chun Peng ,  Heng-Jen Lee

    发明人： Jui-Chun Peng ,  Heng-Jen Lee

    IPC分类号： B08B3/00 ,  G03F7/20 ,  H01L21/67

    CPC分类号： G03F7/70341 ,  G03F7/70925 ,  H01L21/67057

    摘要： An apparatus includes a wafer stage configured to secure a wafer; and a cleaning module including a tank adjacent to the wafer stage, and is positioned outside the region occupied by the wafer. The cleaning module is configured to receive de-ionized (DI) water into the tank and extract the DI water out of the tank. The tank is configured to hold DI water with a top surface of the DI water substantially level with a top surface of the wafer.

    System and method for cleaning a wafer chuck
    4.
    发明授权
    System and method for cleaning a wafer chuck 有权
    用于清洁晶片卡盘的系统和方法

    公开(公告)号：US08955530B2

    公开(公告)日：2015-02-17

    申请号：US13008707

    申请日：2011-01-18

    申请人： Jui-Chun Peng ,  Heng-Jen Lee

    发明人： Jui-Chun Peng ,  Heng-Jen Lee

    IPC分类号： B08B7/00 ,  H01L21/67

    CPC分类号： H01L21/67028

    摘要： A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.

    摘要翻译： 使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。 清洁盖被配置成覆盖并与晶片卡盘对准，并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。 清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。 在使用期间，当第二辊围绕其轴旋转时，清洁布从第一辊滚动到第二辊上。 清洁盖可以通过操纵器相对于晶片卡盘定位，以确保清洁布以足够的力与晶片卡盘接触。 清洁布用平移运动和旋转运动擦拭晶片卡盘。

    Method and apparatus for reducing down time of a lithography system
    5.
    发明授权
    Method and apparatus for reducing down time of a lithography system 有权
    降低光刻系统时间的方法和装置

    公开(公告)号：US08237132B2

    公开(公告)日：2012-08-07

    申请号：US12486565

    申请日：2009-06-17

    申请人： Jui-Chun Peng ,  Heng-Jen Lee ,  Tung-Li Wu ,  I-Hsiung Huang

    发明人： Jui-Chun Peng ,  Heng-Jen Lee ,  Tung-Li Wu ,  I-Hsiung Huang

    IPC分类号： G21K5/00

    CPC分类号： G03B27/54 ,  G03F7/70033 ,  G03F7/70916 ,  H05G2/005 ,  H05G2/008

    摘要： An apparatus includes a radiation source that emits a radiation beam that causes substantially all of a quantity of material to evaporate; and structure having first and second surface portions, a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion, and a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion. A different aspect involves emitting a radiation beam toward a quantity of material, the radiation beam causing substantially all of the quantity of material to evaporate; operating a structure having first and second surface portions in a first operational mode wherein a greater quantity of a byproduct of the evaporation impinges on the first surface portion; and thereafter operating the structure in a second operational mode wherein a greater quantity of the byproduct impinges on the second surface portion.

    摘要翻译： 一种装置包括辐射源，辐射源发射基本上所有的一定量物质蒸发的辐射束; 以及具有第一和第二表面部分的结构，第一操作模式，其中更大量的蒸发副产物撞击在第一表面部分上，以及第二操作模式，其中较大量的副产物撞击在第二表面部分上。 不同的方面涉及朝向一定数量的材料发射辐射束，所述辐射束导致基本上所有量的材料蒸发; 在第一操作模式中操作具有第一和第二表面部分的结构，其中更大量的蒸发副产物撞击在第一表面部分上; 然后以第二操作模式操作该结构，其中较大量的副产物撞击在第二表面部分上。

    In-Situ Immersion Hood Cleaning
    6.
    发明申请
    In-Situ Immersion Hood Cleaning 有权
    原位浸入式清洁罩

    公开(公告)号：US20120180823A1

    公开(公告)日：2012-07-19

    申请号：US13008605

    申请日：2011-01-18

    申请人： Jui-Chun Peng ,  Heng-Jen Lee

    发明人： Jui-Chun Peng ,  Heng-Jen Lee

    IPC分类号： B08B3/00

    CPC分类号： G03F7/70341 ,  G03F7/70925 ,  H01L21/67057

    摘要： An apparatus includes a wafer stage configured to secure a wafer; and a cleaning module including a tank adjacent to the wafer stage, and is positioned outside the region occupied by the wafer. The cleaning module is configured to receive de-ionized (DI) water into the tank and extract the DI water out of the tank. The tank is configured to hold DI water with a top surface of the DI water substantially level with a top surface of the wafer.

    摘要翻译： 一种装置包括晶片台，其被配置为固定晶片; 以及清洁模块，其包括与晶片台相邻的罐，并且位于晶片占据的区域的外部。 清洁模块被配置为将去离子（DI）水接收到罐中并将DI水从罐中提取出来。 该罐配置成保持去离子水，其中DI水的顶表面与晶片的顶表面基本一致。

    System and Method for Cleaning a Wafer Chuck
    7.
    发明申请
    System and Method for Cleaning a Wafer Chuck 有权
    清洁晶片卡盘的系统和方法

    公开(公告)号：US20120180813A1

    公开(公告)日：2012-07-19

    申请号：US13008707

    申请日：2011-01-18

    申请人： Jui-Chun Peng ,  Heng-Jen Lee

    发明人： Jui-Chun Peng ,  Heng-Jen Lee

    IPC分类号： B08B7/00 ,  A47L9/04 ,  A47L13/10

    CPC分类号： H01L21/67028

    摘要： A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.

    摘要翻译： 使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。 清洁盖被配置成覆盖并与晶片卡盘对准，并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。 清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。 在使用期间，当第二辊围绕其轴旋转时，清洁布从第一辊滚动到第二辊上。 清洁盖可以通过操纵器相对于晶片卡盘定位，以确保清洁布以足够的力与晶片卡盘接触。 清洁布用平移运动和旋转运动擦拭晶片卡盘。

    Enhanced scanner throughput system and method
    9.
    发明授权
    Enhanced scanner throughput system and method 有权
    增强扫描仪吞吐量系统和方法

    公开(公告)号：US08906599B2

    公开(公告)日：2014-12-09

    申请号：US13473695

    申请日：2012-05-17

    申请人： Yu-Mei Liu ,  Chin-Hsiang Lin ,  Heng-Hsin Liu ,  Heng-Jen Lee ,  I-Hsiung Huang ,  Chih-Wei Lin

    发明人： Yu-Mei Liu ,  Chin-Hsiang Lin ,  Heng-Hsin Liu ,  Heng-Jen Lee ,  I-Hsiung Huang ,  Chih-Wei Lin

    IPC分类号： G03F7/20

    CPC分类号： G03F7/70358

    摘要： A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.

    摘要翻译： 提供了一种提高扫描仪吞吐量的方法和系统。 使用连续线性扫描程序将来自掩模版的图像投影到基板上，其中连续扫描整列管芯或裸片的单元，即不进入不同的位置。 每个扫描包括相对于固定光束平移衬底。 当底物被翻译时，掩模版也被翻译。 当模具的第一裸片或裸片投影到衬底上时，标线沿着与扫描方向相反的方向平移，并且随着扫描沿着相同的方向继续，标线片然后沿着衬底的相反方向平移，从而形成倒置图案 在下一个死亡或细胞。 与曝光底物相关的时间最小化，因为步进操作仅在扫描完整的单元格列之后才发生。