公开(公告)号：US20080134500A1

公开(公告)日：2008-06-12

申请号：US11987976

申请日：2007-12-06

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H05K3/00

CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

摘要翻译： 一种布线电路板的制造方法，其特征在于，具有：制作具有绝缘层的布线电路基板和包含被绝缘层覆盖的导线图案的布线电路基板和从绝缘层露出的端子部，配置由 具有比形成导电图案的导电材料的标准电极电位低的材料，使得接触构件与导电图案接触并从绝缘层露出，并将包括所设置的接触构件的布线电路板浸入聚合 导电聚合物的溶液以在绝缘层的表面上形成半导体层。

公开(公告)号：US07557049B2

公开(公告)日：2009-07-07

申请号：US11976234

申请日：2007-10-23

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H01L21/31

CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。

公开(公告)号：US07694416B2

公开(公告)日：2010-04-13

申请号：US11987976

申请日：2007-12-06

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H05K3/02

CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

摘要翻译： 一种布线电路板的制造方法，其特征在于，具有：制作具有绝缘层的布线电路基板和包含被绝缘层覆盖的导线图案的布线电路基板和从绝缘层露出的端子部，配置由 具有比形成导电图案的导电材料的标准电极电位低的材料，使得接触构件与导电图案接触并从绝缘层露出，并将包括所设置的接触构件的布线电路板浸入聚合 导电聚合物的溶液以在绝缘层的表面上形成半导体层。

公开(公告)号：US20080102609A1

公开(公告)日：2008-05-01

申请号：US11976235

申请日：2007-10-23

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H01L21/20

CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/1157

摘要： A method for producing a wired circuit board includes the steps of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, and forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer. An oxidation-reduction potential of the polymeric liquid of the conductive polymer is lower than a standard electrode potential of a conductive material forming the conductive pattern.

摘要翻译： 一种布线电路板的制造方法，其特征在于，包括以下步骤：制作布线电路基板，所述布线电路基板包括绝缘层和具有被所述绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部，以及在所述绝缘层上形成半导体层 通过将布线电路板浸渍在导电聚合物的聚合物液体中来形成绝缘层的表面。 导电聚合物的聚合物液体的氧化还原电位低于形成导电图案的导电材料的标准电极电位。

公开(公告)号：US20080102608A1

公开(公告)日：2008-05-01

申请号：US11976234

申请日：2007-10-23

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

IPC分类号： H01L21/20

CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。