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    Producing method of wired circuit board
    1.
    发明申请
    Producing method of wired circuit board 有权
    有线电路板的生产方法

    公开(公告)号：US20080134500A1

    公开(公告)日：2008-06-12

    申请号：US11987976

    申请日：2007-12-06

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H05K3/00

    CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，具有：制作具有绝缘层的布线电路基板和包含被绝缘层覆盖的导线图案的布线电路基板和从绝缘层露出的端子部，配置由 具有比形成导电图案的导电材料的标准电极电位低的材料，使得接触构件与导电图案接触并从绝缘层露出，并将包括所设置的接触构件的布线电路板浸入聚合 导电聚合物的溶液以在绝缘层的表面上形成半导体层。

    Producing method of wired circuit board
    2.
    发明授权
    Producing method of wired circuit board 有权
    有线电路板的生产方法

    公开(公告)号：US07694416B2

    公开(公告)日：2010-04-13

    申请号：US11987976

    申请日：2007-12-06

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H05K3/02

    CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0329 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，具有：制作具有绝缘层的布线电路基板和包含被绝缘层覆盖的导线图案的布线电路基板和从绝缘层露出的端子部，配置由 具有比形成导电图案的导电材料的标准电极电位低的材料，使得接触构件与导电图案接触并从绝缘层露出，并将包括所设置的接触构件的布线电路板浸入聚合 导电聚合物的溶液以在绝缘层的表面上形成半导体层。

    Method for producing a wired circuit board
    3.
    发明申请
    Method for producing a wired circuit board 审中-公开
    布线电路板的制造方法

    公开(公告)号：US20080102609A1

    公开(公告)日：2008-05-01

    申请号：US11976235

    申请日：2007-10-23

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H01L21/20

    CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/1157

    摘要： A method for producing a wired circuit board includes the steps of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, and forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer. An oxidation-reduction potential of the polymeric liquid of the conductive polymer is lower than a standard electrode potential of a conductive material forming the conductive pattern.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，包括以下步骤：制作布线电路基板，所述布线电路基板包括绝缘层和具有被所述绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部，以及在所述绝缘层上形成半导体层 通过将布线电路板浸渍在导电聚合物的聚合物液体中来形成绝缘层的表面。 导电聚合物的聚合物液体的氧化还原电位低于形成导电图案的导电材料的标准电极电位。

    Producing method of wired circuit board
    4.
    发明申请
    Producing method of wired circuit board 失效
    有线电路板的生产方法

    公开(公告)号：US20080102608A1

    公开(公告)日：2008-05-01

    申请号：US11976234

    申请日：2007-10-23

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H01L21/20

    CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

    摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。

    Producing method of wired circuit board
    5.
    发明授权
    Producing method of wired circuit board 失效
    有线电路板的生产方法

    公开(公告)号：US07557049B2

    公开(公告)日：2009-07-07

    申请号：US11976234

    申请日：2007-10-23

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Hiroyuki Kurai

    IPC分类号： H01L21/31

    CPC分类号： H05K1/0259 ,  H05K3/28 ,  H05K2201/0329 ,  H05K2203/135

    摘要： A producing method of a wired circuit board includes the step of preparing a wired circuit board including an insulating layer and a conductive pattern having a wire covered with the insulating layer and a terminal portion exposed from the insulating layer; and the step of forming a semiconductive layer on a surface of the insulating layer by dipping the wired circuit board in a polymeric liquid of a conductive polymer in which an electrode is provided, and applying a voltage so that the electrode becomes an anode and the conductive pattern becomes a cathode.

    摘要翻译： 一种布线电路板的制造方法，其特征在于，包括：制作布线电路基板的步骤，所述布线电路基板包括绝缘层和具有被绝缘层覆盖的导线的导电图案和从所述绝缘层露出的端子部分; 以及通过将布线电路板浸渍在其中提供电极的导电聚合物的聚合物液体中并且施加电压使得电极变为阳极并且导电的方式在绝缘层的表面上形成半导体层的步骤 图案变成阴极。

    Wired circuit board and producing method thereof
    6.
    发明授权
    Wired circuit board and producing method thereof 失效
    有线电路板及其制造方法

    公开(公告)号：US08164002B2

    公开(公告)日：2012-04-24

    申请号：US12004038

    申请日：2007-12-20

    申请人： Jun Ishii ,  Yasunari Ooyabu

    发明人： Jun Ishii ,  Yasunari Ooyabu

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0329

    摘要： A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semiconductive layer formed on a surface of the insulating base layer exposed from the conductive pattern, an insulating cover layer formed on the conductive pattern and the first semiconductive layer and a second semiconductive layer formed on a surface of the insulating cover layer. The first semiconductive layer is electrically connected to the conductive pattern and the metal supporting board, and the second semiconductive layer is electrically connected to the metal supporting board.

    摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在从导电图案露出的绝缘基底层的表面上的第一半导体层， 形成在导电图案和第一半导体层上的绝缘覆盖层和形成在绝缘覆盖层的表面上的第二半导体层。 第一半导电层电连接到导电图案和金属支撑板，并且第二半导体层电连接到金属支撑板。

    Wired circuit board and production method thereof
    7.
    发明授权
    Wired circuit board and production method thereof 失效
    有线电路板及其制作方法

    公开(公告)号：US07782571B2

    公开(公告)日：2010-08-24

    申请号：US11783024

    申请日：2007-04-05

    申请人： Jun Ishii ,  Yasunari Ooyabu

    发明人： Jun Ishii ,  Yasunari Ooyabu

    IPC分类号： G11B5/48

    CPC分类号： G11B5/486 ,  H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28

    摘要： A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second semi-conductive layer formed on the insulating cover layer. The first semi-conductive layer and the second semi-conductive layer are electrically connected to the metal supporting board.

    摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电图案上的第一半导电层，形成在绝缘覆盖层上的绝缘覆盖层 第一半导体层和形成在绝缘覆盖层上的第二半导体层。 第一半导体层和第二半导电层电连接到金属支撑板。

    Wired circuit board and connection structure between wired circuit boards
    8.
    发明申请
    Wired circuit board and connection structure between wired circuit boards 有权
    有线电路板和有线电路板之间的连接结构

    公开(公告)号：US20090044969A1

    公开(公告)日：2009-02-19

    申请号：US12219343

    申请日：2008-07-21

    申请人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

    发明人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

    IPC分类号： H05K1/14

    CPC分类号： H05K3/363 ,  H05K1/056 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09381 ,  H05K2203/167

    摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

    摘要翻译： 布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。 面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合 具有第二相对表面的第一相对表面。