METHOD OF CUTTING WORKPIECE WITH WIRE SAW, AND WIRE SAW
    1.
    发明申请
    METHOD OF CUTTING WORKPIECE WITH WIRE SAW, AND WIRE SAW 有权
    用线锯切割工件的方法和电线

    公开(公告)号:US20120298090A1

    公开(公告)日:2012-11-29

    申请号:US13576738

    申请日:2010-02-08

    IPC分类号: B28D5/04

    摘要: The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.

    摘要翻译: 本发明提供了一种通过利用张力调节器来有效地切割工件的方法,以使线锯中的线材的张力近似到预定的目标张力,同时有效地仅减小缠绕器线材中的张力。 该方法包括:向前驱动切割步骤,在向前移动线的同时切割工件;反转线的驱动方向的第一切换步骤;向后移动切割工件的向后驱动切割步骤;以及 第二切换步骤,其使线的驱动方向反转并返回到前进驱动的切割步骤,按顺序重复该步骤。 在两个切换步骤中,仅通过张力操纵器减小卷绕机侧线中的张力。 在每个切换步骤中线材的减速完成之后,执行目标线张力的降低。

    Method of cutting workpiece with wire saw, and wire saw
    2.
    发明授权
    Method of cutting workpiece with wire saw, and wire saw 有权
    用线锯和线锯切割工件的方法

    公开(公告)号:US08991381B2

    公开(公告)日:2015-03-31

    申请号:US13576738

    申请日:2010-02-08

    IPC分类号: B28D5/04 B23D57/00 B24B27/06

    摘要: The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.

    摘要翻译: 本发明提供了一种通过利用张力调节器来有效地切割工件的方法,以使线锯中的线材的张力近似到预定的目标张力,同时有效地仅减小缠绕器线材中的张力。 该方法包括:向前驱动切割步骤,在向前移动线的同时切割工件;反转线的驱动方向的第一切换步骤;向后移动切割工件的向后驱动切割步骤;以及 第二切换步骤,其使线的驱动方向反转并返回到前进驱动的切割步骤,按顺序重复该步骤。 在两个切换步骤中,仅通过张力操纵器减小卷绕机侧线中的张力。 在每个切换步骤中线材的减速完成之后,执行目标线张力的降低。

    WIRE SAW
    3.
    发明申请
    WIRE SAW 有权
    电线

    公开(公告)号:US20120298091A1

    公开(公告)日:2012-11-29

    申请号:US13577051

    申请日:2010-02-08

    IPC分类号: B28D5/04

    摘要: The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

    摘要翻译: 本发明提供一种线锯,其使用切割线切割工件,并且能够以高响应性调节线张力。 线锯包括第一和第二工件切割单元1A和1B。 每个工件切割单元1A和1B包括一对引导辊10a和10b,绕线W缠绕在其上以形成工件切割线组。 线锯进一步包括检测工件切割单元1A和1B之间的线W中的张力的张力检测器18和控制装置50.控制装置50将导辊10a和10b的旋转速度改变为至少一个 基于由张力检测器18检测到的张力的工件切割单元,以将张力保持在可接受的范围内。

    Wire saw with tension detecting means and guide roller speed control
    4.
    发明授权
    Wire saw with tension detecting means and guide roller speed control 有权
    线锯带张力检测装置和导辊速度控制

    公开(公告)号:US08881716B2

    公开(公告)日:2014-11-11

    申请号:US13577051

    申请日:2010-02-08

    IPC分类号: B23D57/00 B24B27/06 B28D5/04

    摘要: The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

    摘要翻译: 本发明提供一种线锯,其使用切割线切割工件,并且能够以高响应性调节线张力。 线锯包括第一和第二工件切割单元1A和1B。 每个工件切割单元1A和1B包括一对引导辊10a和10b,绕线W缠绕在其上以形成工件切割线组。 线锯进一步包括检测工件切割单元1A和1B之间的线W中的张力的张力检测器18和控制装置50.控制装置50将导辊10a和10b的旋转速度改变为至少一个 基于由张力检测器18检测到的张力的工件切割单元,以将张力保持在可接受的范围内。

    Slicing machine and control method thereof
    5.
    发明授权
    Slicing machine and control method thereof 失效
    切片机及其控制方法

    公开(公告)号:US5025593A

    公开(公告)日:1991-06-25

    申请号:US297473

    申请日:1989-01-13

    IPC分类号: B23D59/00 B23Q15/12

    摘要: A slicing machine of this invention includes a blade having a cutting edge for slicing a silicon ingot, a tension disk for rotatably supporting the blade, a drive motor for rotating the blade, a deformation detection mechanism for detecting a deformation amount of the blade, and a control unit responsive to the measured deformation for correcting the relative position between the support base and the blade. A control method of the slicing machine is also disclosed.

    摘要翻译: 本发明的切片机包括具有用于切割硅锭的切割边缘的刀片,用于可旋转地支撑刀片的张紧盘,用于旋转刀片的驱动马达,用于检测刀片的变形量的变形检测机构,以及 响应于测量的变形以校正支撑基座和叶片之间的相对位置的控制单元。 还公开了一种切片机的控制方法。

    Device for detecting a displacement of a blade member of a slicing
apparatus
    6.
    发明授权
    Device for detecting a displacement of a blade member of a slicing apparatus 失效
    用于检测切片装置的刀片部件的位移的装置

    公开(公告)号:US5681204A

    公开(公告)日:1997-10-28

    申请号:US559406

    申请日:1995-11-15

    CPC分类号: B23D59/002

    摘要: A detecting device for use in a slicing apparatus which includes a blade member having an internal cutting edge in the form of a circle, a rotating driver for rotating the blade member about a center of the circle of the internal cutting edge, and a radial movement driver for producing a relative movement between the blade member and a work in a radial direction of the blade member so that an end portion of the work is cut into a piece by the internal cutting edge of the blade member, the detecting device being adapted for detecting a displacement of the blade member, includes: a detector which is disposed at a position being spaced away from the blade member and the work and allowing the piece in the process of being cut to intervene between the detector and the blade member and being operable to detect a distance to a specified position of the blade member; and a corrector which is operable to eliminate an influence to the distance detection which is caused by the intervention of the piece.

    摘要翻译: 一种用于切片装置的检测装置,其包括具有圆形内部切割刃的刀片构件,用于使刀片构件围绕内切削刃的圆的中心旋转的旋转驱动器,以及径向运动 驱动器,其用于在所述刀片构件和所述刀片构件的径向方向上的工件之间产生相对运动,使得所述工件的端部通过所述刀片构件的内切割刃切割成片,所述检测装置适于 检测所述叶片构件的位移,包括:检测器,其设置在与所述叶片构件和所述工件间隔开的位置处,并且允许所述构件在切割过程中介入所述检测器和所述叶片构件之间并且可操作 以检测到所述刀片构件的指定位置的距离; 以及校正器,其可操作以消除由该片干涉引起的对距离检测的影响。

    Method and apparatus for slicing a work
    7.
    发明授权
    Method and apparatus for slicing a work 失效
    用于切片工作的方法和装置

    公开(公告)号:US5902171A

    公开(公告)日:1999-05-11

    申请号:US918923

    申请日:1997-08-26

    CPC分类号: B23D59/002 B28D5/028

    摘要: An apparatus for slicing a work includes: a blade member rotating device which rotates a blade member having an internal circular cutting edge; a radial moving device which produces a relative movement between the blade member and a work in a radial direction of the blade member to cut an end portion of the work; an axial moving device which produces a relative movement between the blade member and the work in an axial direction of the blade member; a displacement detector which detects an axial displacement of an inner portion of the rotating blade member; a rotational controller which controls the rotational speed of the blade member based on a detected axial displacement to reduce the axial displacement; and an axial movement controller which controls the axial relative movement between the blade member and the work based on the detected axial displacement so that an actual cutting position of the internal cutting edge with respect to the work is at a predetermined cutting reference position.

    摘要翻译: 一种用于切割工件的设备包括:叶片构件旋转装置,其使具有内部圆形切割刃的叶片构件旋转; 径向移动装置,其在所述刀片构件和所述工件之间在所述刀片构件的径向方向上产生相对运动,以切割所述工件的端部; 轴向移动装置,其在叶片构件的轴向方向上产生叶片构件和作业之间的相对运动; 位移检测器,其检测所述旋转叶片构件的内部的轴向位移; 旋转控制器,其基于检测到的轴向位移来控制所述叶片构件的旋转速度,以减小所述轴向位移; 以及轴向移动控制器,其基于检测到的轴向位移来控制所述刀片构件和所述工件之间的轴向相对运动,使得所述内部切削刃相对于所述工件的实际切割位置处于预定的切割参考位置。

    Wafer producing apparatus
    8.
    发明授权
    Wafer producing apparatus 失效
    晶圆生产设备

    公开(公告)号:US5975741A

    公开(公告)日:1999-11-02

    申请号:US814849

    申请日:1997-03-11

    CPC分类号: H01L21/67727 H01L21/67276

    摘要: In the wafer producing apparatus of this invention, wafers each obtained by a slicing operation of a plurality of slicing devices are transported to a common finishing device by a transport device for chamfering. When the wafer is transferred to the transport device, an identification signal for identifying the slicing device by which the wafer is obtained is stored in an identification signal storage device. When the wafer is transferred from the transport device to the finishing device, the identification signal stored in the identification signal storage device is transmitted on a finish control device. Upon completion of the chamfering operation to the wafer by the finishing device, the finish control device controls the finishing device to allow the wafer to be stored in one of a plurality of wafer storage cassettes corresponding to the inputted identification signal. Thereby, even in a case where a working speed of the working device for slicing out a wafer from an ingot differs greatly from a working speed of the finishing device for chamfering the wafer, the wafer producing apparatus can be operated with a high proficiency and wafers processed by the common finishing device can be accurately stored in the proper wafer storage portion.

    摘要翻译: 在本发明的晶片制造装置中,通过多个切片装置的切片操作获得的晶片通过倒角用输送装置输送到普通的精加工装置。 当将晶片转移到传送装置时,将识别用于识别获得晶片的切片装置的识别信号存储在识别信号存储装置中。 当晶片从传送装置传送到整理装置时,存储在识别信号存储装置中的识别信号在完成控制装置上传输。 通过精加工装置完成对晶片的倒角操作后,精加工控制装置控制精加工装置,以允许将晶片存储在与输入的识别信号相对应的多个晶片存储盒中的一个中。 因此,即使在用于从晶锭切片晶片的工作装置的工作速度与用于倒角晶片的精加工装置的工作速度差异的情况下,晶片制造装置也可以以高精度和晶片 由普通整理装置处理的图像可以精确地存储在适当的晶片存储部分中。