公开(公告)号：US20110068455A1

公开(公告)日：2011-03-24

申请号：US12565355

申请日：2009-09-23

申请人： Jun Yong WANG ,  Geng-Shin Shen

发明人： Jun Yong WANG ,  Geng-Shin Shen

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L24/13 ,  H01L21/56 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： This invention relates to a packaging structure and method for manufacturing the packaging structure. The packaging structure comprises a substrate film, a plurality of chips, a compound resin layer and a support layer. The substrate film is formed with circuits having a plurality of terminals exposed from a solder mask. The chips, each of which has a plurality of pads, under bump metals (UBMs) formed on the pads, and composite bumps disposed onto the UBMs, are bonded onto the substrate film to form the first tape. The second tape comprises the support layer and the compound resin layer formed on the support layer. The first tape and the second tape are both in reel-form and are expanded towards a pair of rollers to be heated and pressurized for encapsulating the chips.

摘要翻译： 本发明涉及用于制造包装结构的包装结构和方法。 包装结构包括基底膜，多个芯片，复合树脂层和支撑层。 衬底膜由具有从焊料掩模暴露的多个端子的电路形成。 每个芯片具有多个焊盘，形成在焊盘上的凸块下金属（UBM）和设置在UBM上的复合凸块相连接，形成第一条带。 第二带包括支撑层和形成在支撑层上的复合树脂层。 第一带和第二带都是卷状的并且朝向一对辊膨胀，以被加热和加压以封装芯片。