Method for producing copper-clad laminate
    3.
    发明申请
    Method for producing copper-clad laminate 审中-公开
    覆铜层压板的制造方法

    公开(公告)号:US20090229750A1

    公开(公告)日:2009-09-17

    申请号:US12382070

    申请日:2009-03-06

    Abstract: The present invention provides a method for producing a copper-clad laminate, the method comprising the step of placing at least one copper foil onto a resin layer containing a liquid crystalline polymer so that the resin layer adheres to a surface of the copper foil, wherein the surface of the copper foil has 0.4 or more of a ratio of nickel concentration to copper concentration and has substantially no silicon detected when measured with X-ray photoelectron spectroscopy. The copper-clad laminate can sufficiently maintain excellent adhesion between the copper foil and the resin layer even under high temperature and humidity atmosphere.

    Abstract translation: 本发明提供一种覆铜层压板的制造方法,该方法包括将至少一层铜箔放置在含有液晶聚合物的树脂层上,使树脂层粘附在铜箔的表面, 铜箔的表面的镍浓度与铜浓度的比例为0.4以上,并且在用X射线光电子能谱测定时基本上没有检测到硅。 覆铜层压板即使在高温高湿环境下也能够充分地保持铜箔和树脂层之间的优异的粘附性。

Patent Agency Ranking