Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

    公开(公告)号:US10575438B1

    公开(公告)日:2020-02-25

    申请号:US16221229

    申请日:2018-12-14

    Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

    Supplemental connection fabric for chassis-based network device

    公开(公告)号:US10277534B2

    公开(公告)日:2019-04-30

    申请号:US15170608

    申请日:2016-06-01

    Abstract: A system may receive, by a switching component of the system, network traffic to be provided to an I/O component of the network device. The system may route, by the switching component, the network traffic to the I/O component based on whether the I/O component is connected to the switching component via the first connections and/or via second connections. The first connections may be connections via a chassis of the system. The second connections may be connections via a connector component that is removable from the switching component. The network traffic may be routed via the first connections and the second connections when the I/O component is connected via the first connections and the second connections. The network traffic may be routed via the first connections and not via the second connections when the I/O component is connected via the first connections and not via the second connections.

    Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

    公开(公告)号:US11076502B1

    公开(公告)日:2021-07-27

    申请号:US16734320

    申请日:2020-01-04

    Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

    Fan-out in ball grid array (BGA) package

    公开(公告)号:US10249596B1

    公开(公告)日:2019-04-02

    申请号:US15198253

    申请日:2016-06-30

    Abstract: In some examples, a device includes at least two integrated circuits (ICs) and a first multi-chip module (MCM) substrate coupled to the at least two ICs, the first MCM substrate comprising a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA. The device further includes a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch. The device further includes a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA, wherein the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.

    Method and apparatus for detection and correction of channel failure in an optical transceiver system
    10.
    发明授权
    Method and apparatus for detection and correction of channel failure in an optical transceiver system 有权
    用于在光收发器系统中检测和校正信道故障的方法和装置

    公开(公告)号:US09118411B1

    公开(公告)日:2015-08-25

    申请号:US14042068

    申请日:2013-09-30

    CPC classification number: H04B10/035 H04B10/032

    Abstract: In some embodiments, an apparatus includes an optical transceiver system that includes a set of optical transmitters and a backup optical transmitter. In such embodiments, each optical transmitter from the set of optical transmitter can transmit at a unique wavelength from a set of wavelengths. The backup optical transmitter can transmit at a wavelength from the set of wavelengths when an optical transmitter from the set of optical transmitters associated with that wavelength fails. In other embodiments, an apparatus includes an optical transceiver system that includes a set of optical receivers and a backup optical receiver. The backup optical receiver can receive at a wavelength from the set of wavelengths when an optical receiver from the set of optical receivers associated with that wavelength fails.

    Abstract translation: 在一些实施例中,装置包括光收发器系统,其包括一组光发射器和备用光发射器。 在这样的实施例中,来自一组光发射机的每个光发射机可以从一组波长以独特的波长传输。 当来自与该波长相关联的一组光发射机的光发射机发生故障时,备用光发射机可以从一组波长的波长发射。 在其他实施例中,一种装置包括光收发器系统,其包括一组光接收器和备用光接收器。 当来自与该波长相关联的一组光接收机的光接收机失效时,备用光接收机可以从一组波长的波长接收。

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