公开(公告)号：US10943848B1

公开(公告)日：2021-03-09

申请号：US16526847

申请日：2019-07-30

Applicant: Juniper Networks, Inc.

Inventor： Alexander I. Yatskov ,  Elmer Tolentino ,  Gautam Ganguly ,  Jimmy Chun-Chuen Leung

IPC: H01L23/40 ,  F28F13/00 ,  H05K7/20

Abstract: The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20220115309A1

公开(公告)日：2022-04-14

申请号：US17066934

申请日：2020-10-09

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Aliaska Hassanzadeh ,  Valery Kugel ,  Gautam Ganguly

IPC: H01L23/498 ,  H01L23/40 ,  H01R12/70 ,  H01R13/639 ,  H01R12/71

Abstract: A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20190200479A1

公开(公告)日：2019-06-27

申请号：US15854840

申请日：2017-12-27

Applicant: Juniper Networks, Inc.

Inventor： Alexander I. Yatskov ,  Gautam Ganguly ,  Richard Singer

IPC: H05K7/20 ,  F28F13/00

CPC classification number: H05K7/2039 ,  F28F13/00 ,  F28F2275/10 ,  H01L23/3672 ,  H01L23/4006

Abstract: The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

公开(公告)号：US11158564B1

公开(公告)日：2021-10-26

申请号：US17135133

申请日：2020-12-28

Applicant: Juniper Networks, Inc.

Inventor： Alexander I. Yatskov ,  Elmer Tolentino ,  Gautam Ganguly ,  Jimmy Chun-Chuen Leung

IPC: H05K7/20 ,  H01L23/40 ,  F28F13/00

Abstract: The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20190104607A1

公开(公告)日：2019-04-04

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/40 ,  H05K1/111 ,  H05K1/18 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2203/167

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10477728B2

公开(公告)日：2019-11-12

申请号：US15854840

申请日：2017-12-27

Applicant: Juniper Networks, Inc.

Inventor： Alexander I. Yatskov ,  Gautam Ganguly ,  Richard Singer

IPC: H05K7/20 ,  F28F13/00 ,  H01L23/367 ,  H01L23/40

Abstract: The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

公开(公告)号：US20190099820A1

公开(公告)日：2019-04-04

申请号：US15723105

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: B23K3/08 ,  H05K3/34

Abstract: The disclosed apparatus may include (1) a removable stiffening brace that (A) temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board and (B) provides structural support to the circuit board to prevent the circuit board from warping during the reflow process and (2) at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US11410920B2

公开(公告)日：2022-08-09

申请号：US17066934

申请日：2020-10-09

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Aliaskar Hassanzadeh ,  Valery Kugel ,  Gautam Ganguly

IPC: H01L23/498 ,  H01L23/40 ,  H01R12/70 ,  H01R12/71 ,  H01R13/639

Abstract: A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10588213B2

公开(公告)日：2020-03-10

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H01L23/40 ,  H01L23/36

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10242941B1

公开(公告)日：2019-03-26

申请号：US15671083

申请日：2017-08-07

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Helen L. Turner ,  Marc D. Hartranft ,  Gautam Ganguly ,  Guhan Subbarayan

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/768 ,  H05K3/34 ,  H05K3/24

Abstract: The disclosed apparatus may include (1) a stiffening brace that (A) is coupled to a top surface of a lidless integrated circuit and (B) includes at least one joint and (2) a removable lid that (A) interfaces with the stiffening brace at the joint, (B) temporarily sits atop the stiffening brace during a reflow process in which a bottom surface of the lidless integrated circuit is soldered to a circuit board, and (C) provides structural support to the lidless integrated circuit to impede the lidless integrated circuit from warping during the reflow process. Various other apparatuses, systems, and methods are also disclosed.