公开(公告)号：US20190099820A1

公开(公告)日：2019-04-04

申请号：US15723105

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: B23K3/08 ,  H05K3/34

Abstract: The disclosed apparatus may include (1) a removable stiffening brace that (A) temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board and (B) provides structural support to the circuit board to prevent the circuit board from warping during the reflow process and (2) at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20220115309A1

公开(公告)日：2022-04-14

申请号：US17066934

申请日：2020-10-09

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Aliaska Hassanzadeh ,  Valery Kugel ,  Gautam Ganguly

IPC: H01L23/498 ,  H01L23/40 ,  H01R12/70 ,  H01R13/639 ,  H01R12/71

Abstract: A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US11410920B2

公开(公告)日：2022-08-09

申请号：US17066934

申请日：2020-10-09

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Aliaskar Hassanzadeh ,  Valery Kugel ,  Gautam Ganguly

IPC: H01L23/498 ,  H01L23/40 ,  H01R12/70 ,  H01R12/71 ,  H01R13/639

Abstract: A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10588213B2

公开(公告)日：2020-03-10

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H01L23/40 ,  H01L23/36

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10242941B1

公开(公告)日：2019-03-26

申请号：US15671083

申请日：2017-08-07

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Helen L. Turner ,  Marc D. Hartranft ,  Gautam Ganguly ,  Guhan Subbarayan

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/768 ,  H05K3/34 ,  H05K3/24

Abstract: The disclosed apparatus may include (1) a stiffening brace that (A) is coupled to a top surface of a lidless integrated circuit and (B) includes at least one joint and (2) a removable lid that (A) interfaces with the stiffening brace at the joint, (B) temporarily sits atop the stiffening brace during a reflow process in which a bottom surface of the lidless integrated circuit is soldered to a circuit board, and (C) provides structural support to the lidless integrated circuit to impede the lidless integrated circuit from warping during the reflow process. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US11322367B1

公开(公告)日：2022-05-03

申请号：US16147093

申请日：2018-09-28

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Bernard H. Glasauer

IPC: H01L21/48 ,  H01L21/67 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18

Abstract: A method includes positioning an integrated circuit package in a coining apparatus having a fixture and a pressing plate. The integrated circuit package includes a substrate, an integrated circuit device disposed on a top surface of the substrate, and a plurality of solder balls disposed on a bottom surface of the integrated circuit package. The fixture includes a support structure and a cavity. The cavity receives the integrated circuit device while the support structure supports portions of a top surface of the integrated circuit package. The pressing plate is pressed against two or more of the solder balls, coining the two or more solder balls until each solder ball has a desired coined surface profile.

公开(公告)号：US11228125B1

公开(公告)日：2022-01-18

申请号：US16891881

申请日：2020-06-03

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Aliaskar Hassanzadeh

IPC: H01R12/71 ,  H01R13/15 ,  H01R43/00

Abstract: A disclosed socket may include (1) a base that is arched to match a degree of warpage experienced by an electrical component and (2) an array of contact pins arranged across the base. A first side of the contact pins may be electrically coupled to a circuit board, and a second side of the contact pins may protrude from the base opposite the circuit board to establish contact with the electrical component despite the degree of warpage experienced by the electrical component. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10943874B1

公开(公告)日：2021-03-09

申请号：US16555773

申请日：2019-08-29

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Valery Kugel ,  Jimmy Chun-Chuen Leung

IPC: H01L23/00 ,  H01L23/10 ,  H01L23/16 ,  H01L21/50

Abstract: The stiffening brace may include a set of borders dimensioned to substantially surround an integrated circuit, wherein each border includes (1) a portion of material that is positioned atop a perimeter of the integrated circuit and (2) an additional portion of material that extends beyond the perimeter of the integrated circuit such that the additional portion of material overhangs a circuit board to which the integrated circuit is soldered. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20190104607A1

公开(公告)日：2019-04-04

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/40 ,  H05K1/111 ,  H05K1/18 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2203/167

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.