摘要:
A lead frame substrate, including: a metal plate having a first surface and a second surface; a semiconductor element mount portion and a semiconductor element electrode connection terminal that are formed on the first surface; an external connection terminal formed on the second surface and electrically connected to the semiconductor element electrode connection terminal; a conducting wire that connects the semiconductor element electrode connection terminal and the external connection terminal to each other; a resin layer formed on the metal plate; a hole portion that is partly formed in the second surface of the metal plate and does not penetrate the metal plate; and a plurality of protrusions that are formed on a bottom surface of the hole portion and protrude in a direction away from the metal plate, the protrusions having a height lower than a position of the second surface, not being in electrical conduction with the conducting wire, and being dispersed separately.
摘要:
A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface.
摘要:
A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface.
摘要:
A lead frame substrate, including: a metal plate having a first surface and a second surface; a semiconductor element mount portion and a semiconductor element electrode connection terminal that are formed on the first surface; an external connection terminal formed on the second surface and electrically connected to the semiconductor element electrode connection terminal; a conducting wire that connects the semiconductor element electrode connection terminal and the external connection terminal to each other; a resin layer formed on the metal plate; a hole portion that is partly formed in the second surface of the metal plate and does not penetrate the metal plate; and a plurality of protrusions that are formed on a bottom surface of the hole portion and protrude in a direction away from the metal plate, the protrusions having a height lower than a position of the second surface, not being in electrical conduction with the conducting wire, and being dispersed separately.
摘要:
Provided is a manufacturing method of a substrate for a semiconductor element, the manufacturing method including the steps of: providing a first photosensitive resin layer at a first surface of a metal plate; providing a second photosensitive resin layer at a second surface of the metal plate different from the first surface; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring post on the second surface of the metal plate; forming the connection post by performing an etching on the first surface of the metal plate from a first surface side to a midway of the metal plate; applying a premold resin in liquid form to the first surface of the metal plate which underwent the etching on the first surface; forming a premold resin layer by solidifying the premold resin in liquid form being applied; and forming a wiring pattern by performing an etching on the second surface of the metal plate from a second surface side.
摘要:
The invention provides a reagent for diluting a blood sample, comprising water, polyoxyethylene alkyl ether having a hydroxyl value of 52 to 60, and an osmo-regulator for regulating the osmotic pressure of the reagent in the range of 150 to 400 mOsm/kg, as well as a method for measuring the mean corpuscular volume of a blood sample.
摘要:
Methods for producing a silica aerogel coating by: producing a wet gel formed by the hydrolysis and polymerization of an alkoxysilane having an ultraviolet-polymerizable unsaturated group; organically modifying the wet gel with an organic-modifying agent to obtain an organically modified silica having a modification ratio of 10-30% based on a total amount of Si—OH in the wet gel; coating a dispersion of the organically modified silica on a substrate to form a layer; and subjecting the layer of the organically modified silica to ultraviolet irradiation and baking, wherein the silica aerogel coating includes the organically modified silica and wherein the silica aerogel coating has a refractive index in the range of 1.05-1.2.
摘要:
A method for producing a silica aerogel coating comprising the steps of organically modifying a wet gel formed by the hydrolysis and polymerization of an alkoxysilane having an ultraviolet-polymerizable unsaturated group, and subjecting a layer of the resultant organically modified silica to ultraviolet irradiation and baking.
摘要:
The present invention relates to a method for producing a resin-impregnated structure reinforced by continuous fibers in which a practically endless continuous fiber bundle is dipped in a bath of molten resin and simultaneously passes through a space between a pair of opening pins. The opening pins can be positioned on sides of the bundle so that the continuous fibers are sandwiched by the pins without coming in contact with them. By doing so, the fibers of the bundle can be opened and can be impregnated with the resin. In addition, the foregoing continuous fiber-reinforced resin structure may be cut into pieces having a desired length to provide columnar products.
摘要:
Organic-inorganic composite particles which include a (meth)acrylic resin framework and a polysiloxane framework having in its molecule an organosilicon containing a silicon atom directly and chemically combined with at least one carbon atom of the (meth)acrylic resin framework, and also contain 25 wt % or more of SiO.sub.2 which constitutes the polysiloxane framework and have a mean particle diameter of .gtoreq.0.5 .mu.m. The particles have the mechanical resilience necessary to maintain a constant gap distance between a pair of members to be arranged with the correct gap distance between them, and the hardness and fracture strength necessary to maintain the gap constant with smaller numbers; and also do not readily cause physical damage to the members. The composite particles can be employed as spacers 8 for a liquid crystal display as they stand or with an adhesive layer formed on the surface. The composite particles can also have a conductive layer formed on the surface, and be employed as conductive particles.