公开(公告)号：US09957633B2

公开(公告)日：2018-05-01

申请号：US14996779

申请日：2016-01-15

Applicant: Just Co., Ltd.

Inventor： Takashi Konno

IPC: C25D15/00 ,  C25D5/14 ,  C25D7/00 ,  C23C28/02 ,  C23C18/16 ,  C23C18/32 ,  C25D5/02 ,  A61B17/30 ,  A61B17/28 ,  A61B17/00

CPC classification number: C25D15/00 ,  A61B17/28 ,  A61B17/30 ,  A61B2017/00429 ,  A61B2017/00858 ,  A61B2017/305 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/32 ,  C23C28/021 ,  C23C28/023 ,  C23C28/027 ,  C25D5/022 ,  C25D5/14 ,  C25D7/00

Abstract: A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.

公开(公告)号：US20160376721A1

公开(公告)日：2016-12-29

申请号：US14996779

申请日：2016-01-15

Applicant: Just Co., Ltd.

Inventor： Takashi Konno

IPC: C25D15/00 ,  C25D7/00 ,  C23C28/02 ,  D05B55/00 ,  C23C18/32 ,  C25D5/02 ,  A61B17/30 ,  A61B17/28 ,  C25D5/14 ,  C23C18/16

CPC classification number: C25D15/00 ,  A61B17/28 ,  A61B17/30 ,  A61B2017/00429 ,  A61B2017/00858 ,  A61B2017/305 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/32 ,  C23C28/021 ,  C23C28/023 ,  C23C28/027 ,  C25D5/022 ,  C25D5/14 ,  C25D7/00

Abstract: A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.

Abstract translation: 夹持工具的夹持表面的电镀处理方法包括：暂时且均匀地固定具有均匀的第一粒径的多个第一金刚石晶粒; 在第一金刚石晶粒暂时固定之后，通过在夹持表面上均匀厚度地沉积含有镍的金属来粘附第一金刚石晶粒; 将具有第二粒径的多个第二金刚石晶粒放置在不存在第一金刚石晶粒的夹持表面的金属表面上; 并且通过在不超过第一直径颗粒和第二直径颗粒的均匀厚度的金属表面上进一步沉积含有镍的第二镀液中的金属，直到金属表面和第二金属颗粒之间的位置关系 即使夹持工具移动，金刚石颗粒也不会移动。

公开(公告)号：US10883186B2

公开(公告)日：2021-01-05

申请号：US15905939

申请日：2018-02-27

Applicant: Just Co., Ltd.

Inventor： Takashi Konno

IPC: B32B15/04 ,  C25D15/00 ,  C25D5/14 ,  C25D7/00 ,  C23C28/02 ,  C23C18/16 ,  C23C18/32 ,  C25D5/02 ,  A61B17/30 ,  A61B17/062 ,  A61B17/28 ,  A61B17/00

Abstract: A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.

公开(公告)号：US20180187325A1

公开(公告)日：2018-07-05

申请号：US15905939

申请日：2018-02-27

Applicant: Just Co., Ltd.

Inventor： Takashi Konno

IPC: C25D15/00 ,  C25D7/00 ,  C25D5/14 ,  A61B17/30 ,  C23C18/16 ,  C25D5/02 ,  C23C28/02 ,  C23C18/32 ,  A61B17/00 ,  A61B17/28

CPC classification number: C25D15/00 ,  A61B17/062 ,  A61B17/28 ,  A61B17/30 ,  A61B2017/00429 ,  A61B2017/00526 ,  A61B2017/00858 ,  A61B2017/305 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/32 ,  C23C28/021 ,  C23C28/023 ,  C23C28/027 ,  C25D5/022 ,  C25D5/14 ,  C25D7/00

Abstract: A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.