公开(公告)号：US20180362806A1

公开(公告)日：2018-12-20

申请号：US15822117

申请日：2017-11-25

Applicant: Samsung Electronics Co., Ltd. ,  K.C.TECH CO., LTD

Inventor： Seung Ho PARK ,  Chang Gil Kwon ,  Sung Pyo LEE ,  Jun Ha HWANG ,  Sang Kyun KIM ,  Hye Sung PARK ,  Su Young SHIN ,  Woo In LEE ,  Yang Hee LEE ,  Jong Hyuk PARK ,  Il Young YOON

IPC: C09G1/02 ,  H01L21/3105

Abstract: Provided are a chemical mechanical polishing (CMP) slurry composition and a method of fabricating a semiconductor device using the same. The chemical mechanical polishing (CMP) slurry composition includes abrasive particles, a first cationic compound which comprises at least any one of an amino acid, a polyalkylene glycol, a polymer polysaccharide to which a glucosamine compound is bonded, and a polymer containing an amine group, a second cationic compound which comprises an organic acid, and a nonionic compound which comprises polyetheramine.

公开(公告)号：US20170183539A1

公开(公告)日：2017-06-29

申请号：US15386502

申请日：2016-12-21

Applicant: K.C.Tech Co., Ltd.

Inventor： Jang Kuk KWON ,  Sung Pyo LEE ,  Chang Gil KWON ,  Jun Ha HWANG

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/306

Abstract: An abrasive particle-dispersion layer composite and a polishing slurry composition including the abrasive particle-dispersion layer composite are provided. The abrasive particle-dispersion layer composite includes abrasive particles, a first dispersant that is at least one cationic compound among an amino acid, an organic acid, polyalkylene glycol and a high-molecular polysaccharide coupled to a glucosamine compound, and a second dispersant that is a cationic polymer including at least two ionized cations in a molecular formula.

公开(公告)号：US20170183538A1

公开(公告)日：2017-06-29

申请号：US15379861

申请日：2016-12-15

Applicant: K.C.Tech Co., Ltd.

Inventor： Jang Kuk KWON ,  Sung Pyo LEE ,  Chang Gil KWON ,  Jun Ha HWANG

IPC: C09G1/02 ,  H01L21/3105 ,  C09G1/04

CPC classification number: C09G1/02 ,  H01L21/31053

Abstract: An additive composition and a positive polishing slurry composition including the additive composition are provided. The additive composition includes a cationic compound, an organic acid, a nonionic compound, and a pH adjuster.