公开(公告)号：US20170040231A1

公开(公告)日：2017-02-09

申请号：US15066667

申请日：2016-03-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuyoshi SATO

IPC: H01L21/66 ,  H01L21/02 ,  H01L21/027

CPC classification number: H01L22/20 ,  G03F7/0002 ,  G03F7/168 ,  H01L21/0212 ,  H01L21/02126 ,  H01L21/02167 ,  H01L21/02252 ,  H01L21/02255 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/31144 ,  H01L22/12

Abstract: A method for processing a substrate exposes a silicon-containing surface at a circumferential edge portion of a first main surface of a substrate to be processed, performs surface processing to the silicon-containing surface to increase a contact angle of the silicon-containing surface with respect to a resist material, comparing with the contact angle before the surface processing is performed, supplies the resist material onto the substrate to be processed after the surface processing, and transfers a template pattern to the resist material.

Abstract translation: 用于处理基板的方法在待处理基板的第一主表面的周缘部露出含硅表面，对含硅表面进行表面处理，以增加含硅表面的接触角， 相对于抗蚀剂材料，与进行表面处理之前的接触角相比，在表面处理后将抗蚀剂材料供给到待处理的基板上，并将模板图案转印到抗蚀剂材料上。

公开(公告)号：US20170040161A1

公开(公告)日：2017-02-09

申请号：US15066616

申请日：2016-03-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuyoshi SATO

IPC: H01L21/027 ,  B29C59/00

CPC classification number: G03F7/0002

Abstract: An imprinting template substrate has a protruded portion, and a protective layer on a side surface of the protruded portion, and having a contact angle higher with respect to a resist material than a contact angle of the protruded portion with respect to the resist material. Even when the template is pressed to the resist, the resist hardly adheres to the side surface of the template. An imprinting process using the present template forms a pattern on a semiconductor substrate and then a semiconductor apparatus is manufactured.

Abstract translation: 压印模板基板具有突出部分和在突出部分的侧表面上的保护层，并且相对于抗蚀剂材料具有比突出部分相对于抗蚀剂材料的接触角更高的接触角。 即使模板被按压到抗蚀剂上，抗蚀剂几乎不粘附到模板的侧表面。 使用本模板的压印工艺在半导体衬底上形成图案，然后制造半导体器件。

公开(公告)号：US20170038677A1

公开(公告)日：2017-02-09

申请号：US15066758

申请日：2016-03-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuyoshi SATO

IPC: G03F7/00

CPC classification number: G03F7/0002

Abstract: A method for manufacturing an imprinting template substrate forms a protruded mesa portion by removing a part of the substrate, and forms a film containing silicon, carbon, and fluorine, on a side surface of the mesa portion. Even when the template is pressed to the resist, the resist barely adheres to the side surface of the template. Therefore, no defect that the resist having adhered to the side surface of the template falls on the wafer and then defective parts increase, occurs.

Abstract translation: 压印模板基板的制造方法通过除去基板的一部分而形成突出的台面部，并且在台面部的侧面形成含有硅，碳，氟的膜。 即使模板被按压到抗蚀剂上，抗蚀剂几乎不粘附在模板的侧表面上。 因此，没有粘附在模板的侧面的抗蚀剂落在晶片上，然后发生缺陷部分的缺陷。