公开(公告)号：US20180359849A1

公开(公告)日：2018-12-13

申请号：US15805195

申请日：2017-11-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akira TANAKA ,  Masaya HIRASHIMA ,  Satoru YASUI ,  Shukuyo YAMADA

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/111 ,  H05K1/183 ,  H05K3/34 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278

Abstract: According to one embodiment, provided are an electronic device and an electronic component protection substrate in which an electronic component is prevented from entering an irregular state. According to the electronic device of the present embodiment, an electronic component is soldered onto a pattern line of a printed circuit substrate, and a surface of the printed circuit substrate where the electronic component is disposed is formed as a recess such that the thickness of the printed circuit substrate in the recess part is thinned.

公开(公告)号：US20200044366A1

公开(公告)日：2020-02-06

申请号：US16524225

申请日：2019-07-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akira TANAKA ,  Masaya HIRASHIMA ,  Satoru YASUI ,  Shukuyo YAMADA ,  Masashi WATANABE

IPC: H01R4/02 ,  H05K1/11

Abstract: According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.

公开(公告)号：US20200006873A1

公开(公告)日：2020-01-02

申请号：US16456294

申请日：2019-06-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shukuyo YAMADA

IPC: H01R12/57 ,  H05K3/34 ,  H05K1/18 ,  H01R12/72 ,  H01R12/71 ,  H01R4/02

Abstract: According to one embodiment, a connector includes a shell including an opening portion into which a plug is removably inserted, and reinforcing terminals which are integrally formed with the shell and are soldered to pads on a wiring substrate. At least the reinforcing terminals adjacent to the opening portion each includes an extending piece which projects from the shell so as to face the wiring substrate, and a leg portion which integrally extends from the extending piece in a direction of opening of the opening portion of the shell and includes a joint piece to be soldered to the pad.