公开(公告)号：US20140226296A1

公开(公告)日：2014-08-14

申请号：US14129399

申请日：2012-02-10

申请人： KABUSHIKI KAISHA TOYOTA , JIDOSHOKKI

发明人： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0263 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/18 ,  H05K3/202 ,  H05K3/4092 ,  H05K3/46 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2203/0195

摘要： This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.

摘要翻译： 该多层布线板设置有绝缘基板，内层铜板和外层铜箔。 内层铜片设置在绝缘基板内并被图案化。 外层铜箔被设置在绝缘基板的表面被图案化的状态下，比内层铜片薄，并且具有小于横截面的电流路径的截面积 内层铜片电流通路面积。 结果，提供了：能够抑制基板的投影面积的增加而能够流过大电流和小电流的多层布线基板; 以及多层布线基板的制造方法。

公开(公告)号：US20140151106A1

公开(公告)日：2014-06-05

申请号：US14118636

申请日：2012-05-23

申请人： KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

发明人： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Harumitsu Sato ,  Hiroki Watanabe ,  Tadayoshi Kachi ,  Takahiro Suzuki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K1/11 ,  H05K1/0263 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2203/033 ,  H05K2203/1178 ,  Y10T29/49165

摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

摘要翻译： 导电路径由第一铜板，第二铜板和焊料构成。 第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。 第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖 ，基材通孔的内壁表面。 在第二铜板的与基材通孔的内侧相对的部分设有通孔。 焊料填充在第一弯曲部分和第二弯曲部分之间。