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公开(公告)号：US09693456B2
公开(公告)日：2017-06-27
申请号：US14438968
申请日：2013-10-23
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimadu , Shigeki Kawaguchi , Tomoaki Asai
CPC分类号： H05K1/115 , H05K1/0203 , H05K1/0206 , H05K1/0209 , H05K1/112 , H05K3/4084 , H05K2201/066
摘要： This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.
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公开(公告)号：US20150289371A1
公开(公告)日：2015-10-08
申请号：US14437059
申请日：2013-10-23
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimadu , Shigeki Kawaguchi , Tomoaki Asai
CPC分类号： H05K1/111 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/26175 , H01L2224/2732 , H01L2224/29013 , H01L2224/29017 , H01L2224/29018 , H01L2224/291 , H01L2224/32227 , H01L2224/83192 , H01L2224/83385 , H01L2224/83815 , H05K1/181 , H05K3/3442 , H05K3/4007 , H05K2201/0373 , H05K2201/09427 , H05K2201/09745 , H05K2201/09827 , H05K2201/2072 , H05K2203/0108 , H05K2203/0465 , Y02P70/611 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.
摘要翻译： 衬底包括绝缘衬底，形成在绝缘衬底的一个表面上的金属层和焊接到金属层的表面的电子部件。 金属层由金属板形成。 金属层的表面具有焊接区域和位于焊接区域的外周上的槽部。
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公开(公告)号：US09655240B2
公开(公告)日：2017-05-16
申请号：US14437059
申请日：2013-10-23
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimadu , Shigeki Kawaguchi , Tomoaki Asai
CPC分类号： H05K1/111 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/26175 , H01L2224/2732 , H01L2224/29013 , H01L2224/29017 , H01L2224/29018 , H01L2224/291 , H01L2224/32227 , H01L2224/83192 , H01L2224/83385 , H01L2224/83815 , H05K1/181 , H05K3/3442 , H05K3/4007 , H05K2201/0373 , H05K2201/09427 , H05K2201/09745 , H05K2201/09827 , H05K2201/2072 , H05K2203/0108 , H05K2203/0465 , Y02P70/611 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.
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公开(公告)号：US20150282313A1
公开(公告)日：2015-10-01
申请号：US14428526
申请日：2013-09-17
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimazu , Tomoaki Asai
CPC分类号： H05K1/11 , H01L2924/19105 , H01L2924/19107 , H05K1/0213 , H05K1/142 , H05K1/181 , H05K3/0073 , H05K3/36 , H05K3/368 , H05K3/4069 , H05K2201/0305 , H05K2201/09145 , H05K2201/10287 , H05K2201/2072 , H05K2203/043 , Y10T29/49126
摘要： A wiring board includes a first substrate including a first surface and a second substrate including a first surface. A solder hole is arranged at least in the first surface of the first substrate. A solder hole is arranged at least in the first surface of the second substrate. The second substrate is coupled to the first substrate. The first substrate and the second substrate are electrically connected with each other. The first surface of the first substrate and the first surface of the second substrate are flush with each other and configured such that a part of one surface of a mask is placed on the first surface of the first substrate and another part of the surface of the mask is placed on the first surface of the second substrate.
摘要翻译： 布线基板包括包括第一表面的第一基板和包括第一表面的第二基板。 至少在第一基板的第一表面中布置有焊料孔。 至少在第二基板的第一表面中布置有焊料孔。 第二衬底耦合到第一衬底。 第一基板和第二基板彼此电连接。 第一基板的第一表面和第二基板的第一表面彼此齐平并且被配置为使得掩模的一个表面的一部分被放置在第一基板的第一表面上，另一部分表面的 掩模放置在第二基板的第一表面上。
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公开(公告)号：US20140151106A1
公开(公告)日：2014-06-05
申请号：US14118636
申请日：2012-05-23
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165
摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.
摘要翻译： 导电路径由第一铜板，第二铜板和焊料构成。 第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。 第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖 ，基材通孔的内壁表面。 在第二铜板的与基材通孔的内侧相对的部分设有通孔。 焊料填充在第一弯曲部分和第二弯曲部分之间。
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公开(公告)号：US20150289375A1
公开(公告)日：2015-10-08
申请号：US14438449
申请日：2013-10-01
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimadu , Shigeki Kawaguchi , Tomoaki Asai
CPC分类号： H05K1/144 , H01F27/2804 , H01F2027/2809 , H01R12/716 , H05K1/0201 , H05K1/181 , H05K3/303 , H05K3/368 , H05K2201/0367 , H05K2201/042 , H05K2201/0969 , H05K2201/10189 , H05K2201/2072 , H05K2203/167 , Y02P70/613
摘要： This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located.
摘要翻译： 该模块包括绝缘基板，其具有位于彼此相对侧的第一表面和第二表面;第一金属层，设置在绝缘基板的第一表面上，并且包括金属板，第二金属层 设置在所述绝缘基板的所述第二表面上的第一电路板，包括所述绝缘基板，所述第一金属层和所述第二金属层的第一电路板，与所述第一金属层接合的电子部件，以及定位部， 第一金属层和电子部件之间的接合表面，第一金属层和电子部件通过凹凸关系彼此接合。 绝缘基板位于第二金属层与位于定位部的第一金属层的一部分之间。
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7.发明申请公开(公告)号：US20150235755A1
公开(公告)日：2015-08-20
申请号：US14428481
申请日：2013-09-12
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Hitoshi Shimazu , Tomoaki Asai
CPC分类号： H01F27/2804 , H01F27/2847 , H01F27/2876 , H01F27/306 , H01F41/045 , H01F2027/2819 , Y10T29/4902
摘要： A planar coil includes an effective line segment, which extends over at least one turn and is configured such that a current flows therein, and a dummy line segment, which extends over at least one turn and is configured such that a current does not flow therein.
摘要翻译： 平面线圈包括有效的线段，其延伸至少一匝并且被配置为使得电流流过其中，虚线段在至少一匝上延伸并且被配置为使得电流不在其中流动 。
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8.发明申请公开(公告)号：US20140226296A1
公开(公告)日：2014-08-14
申请号：US14129399
申请日：2012-02-10
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
CPC分类号： H05K1/0263 , H05K1/0206 , H05K1/0265 , H05K1/18 , H05K3/202 , H05K3/4092 , H05K3/46 , H05K3/4652 , H05K2201/0352 , H05K2201/0397 , H05K2201/10166 , H05K2201/10409 , H05K2203/0195
摘要： This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.
摘要翻译： 该多层布线板设置有绝缘基板，内层铜板和外层铜箔。 内层铜片设置在绝缘基板内并被图案化。 外层铜箔被设置在绝缘基板的表面被图案化的状态下，比内层铜片薄，并且具有小于横截面的电流路径的截面积 内层铜片电流通路面积。 结果，提供了：能够抑制基板的投影面积的增加而能够流过大电流和小电流的多层布线基板; 以及多层布线基板的制造方法。
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