公开(公告)号：US20190017188A1

公开(公告)日：2019-01-17

申请号：US16126470

申请日：2018-09-10

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min KIM ,  Jeong Gil LEE

IPC: C25D3/38 ,  C25D5/48 ,  C25D5/16 ,  C25D7/06 ,  H05K1/03 ,  H05K3/42

CPC classification number: C25D3/38 ,  C25D1/04 ,  C25D5/16 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0393 ,  H05K3/025 ,  H05K3/282 ,  H05K3/423 ,  H05K2201/0335 ,  H05K2203/0723

Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.