SEMICONDUCTOR DEVICE INCLUDING SINGLE POLY NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING SAME

    公开(公告)号:US20230059628A1

    公开(公告)日:2023-02-23

    申请号:US17743691

    申请日:2022-05-13

    IPC分类号: H01L27/11531 H01L29/423

    摘要: A semiconductor device includes: a logic region and a non-volatile memory (NVM) region; a logic gate insulating film disposed on a substrate in the logic region; at least one gate oxidation acceleration ion implantation layer disposed in the NVM region; at least one NVM gate insulating film disposed on the at least one gate oxidation acceleration ion implantation layer; a logic gate electrode disposed on the logic gate insulating film; and at least one NVM gate electrode disposed on the at least one NVM gate insulating film, wherein a thickness of the at least one NVM gate insulating film is equal or greater than a thickness of the logic gate insulating film.

    SINGLE POLY NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230053444A1

    公开(公告)日:2023-02-23

    申请号:US17564367

    申请日:2021-12-29

    摘要: A single poly non-volatile memory device is provided. The single poly non-volatile memory device is formed in a semiconductor substrate, and includes a sensing transistor, a selection transistor, and a capacitor, wherein a thickness of a selection gate insulating film is formed to be thicker than a thickness of a sensing gate insulating film, wherein a thickness of a control gate insulating film of the capacitor is formed to be the same, or greater than, a thickness of the sensing gate insulating film, and wherein the sensing gate of the sensing transistor and the control gate of the capacitor are physically and electrically connected to each other.

    SEMICONDUCTOR DEVICE WITH SINGLE POLY NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD

    公开(公告)号:US20220384472A1

    公开(公告)日:2022-12-01

    申请号:US17531873

    申请日:2021-11-22

    发明人: Su Jin KIM

    摘要: A semiconductor device includes a single poly non-volatile memory device including a sensing and selection gate structure, an erase gate structure, and a control gate structure. The sensing and selection gate structure includes a sensing gate and a selection gate, a bit line, a word line disposed on the selection gate, and a tunneling gate line. The erase gate structure includes an erase gate, and an erase gate line disposed near the erase gate. The control gate structure includes a control gate disposed on the substrate, and a control gate line disposed near the control gate. The sensing gate, the selection gate, the erase gate and the control gate are connected by one conductive layer. The erase gate structure implements a PMOS capacitor, an NMOS transistor, or a PMOS transistor. The semiconductor device includes a single poly non-volatile memory device including a separate program area and erase area.