公开(公告)号：US11443963B2

公开(公告)日：2022-09-13

申请号：US16557705

申请日：2019-08-30

Applicant: KIOXIA CORPORATION

Inventor： Mana Tanabe ,  Kosuke Takai ,  Kenji Masui ,  Kaori Umezawa

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/02

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.

公开(公告)号：US11776823B2

公开(公告)日：2023-10-03

申请号：US17885362

申请日：2022-08-10

Applicant: KIOXIA CORPORATION

Inventor： Mana Tanabe ,  Kosuke Takai ,  Kenji Masui ,  Kaori Umezawa

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B7/0014 ,  H01L21/02057 ,  H01L21/67103

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.