公开(公告)号：US11776823B2

公开(公告)日：2023-10-03

申请号：US17885362

申请日：2022-08-10

Applicant: KIOXIA CORPORATION

Inventor： Mana Tanabe ,  Kosuke Takai ,  Kenji Masui ,  Kaori Umezawa

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B7/0014 ,  H01L21/02057 ,  H01L21/67103

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.

公开(公告)号：US11682566B2

公开(公告)日：2023-06-20

申请号：US17238455

申请日：2021-04-23

Applicant: KIOXIA CORPORATION

Inventor： Kosuke Takai ,  Mana Tanabe ,  Hideaki Sakurai

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B7/0014 ,  B08B7/0092 ,  H01L21/6715 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/68 ,  H01L21/68785

Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.

公开(公告)号：US11443963B2

公开(公告)日：2022-09-13

申请号：US16557705

申请日：2019-08-30

Applicant: KIOXIA CORPORATION

Inventor： Mana Tanabe ,  Kosuke Takai ,  Kenji Masui ,  Kaori Umezawa

IPC: H01L21/67 ,  B08B7/00 ,  H01L21/02

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.