公开(公告)号：US11789365B2

公开(公告)日：2023-10-17

申请号：US16804981

申请日：2020-02-28

Applicant: KIOXIA CORPORATION

Inventor： Ryu Komatsu ,  Takeharu Motokawa ,  Noriko Sakurai ,  Hideaki Sakurai

IPC: G03F7/20 ,  H01L21/027 ,  G03F7/00 ,  G03F7/38 ,  G03F7/16

CPC classification number: G03F7/2041 ,  G03F7/162 ,  G03F7/2004 ,  G03F7/38 ,  G03F7/70341 ,  H01L21/0271

Abstract: A method for processing a substrate includes forming a pattern on a substrate, supplying water to cover the pattern, and after the supplying the water, irradiating the pattern with light having a wavelength longer that which causes dissociation of water. A substrate processing apparatus of an embodiment includes a transfer chamber to receive a patterned substrate, a water supplying chamber to cover the pattern with water, and an irradiating chamber to irradiate a portion of the pattern with near-field light.

公开(公告)号：US11493846B2

公开(公告)日：2022-11-08

申请号：US16817804

申请日：2020-03-13

Applicant: Kioxia Corporation

Inventor： Takeharu Motokawa ,  Noriko Sakurai ,  Ryu Komatsu ,  Hideaki Sakurai

IPC: G03F7/20 ,  G03F7/09 ,  G03F9/00 ,  G03F7/00

Abstract: According to one embodiment, a pattern forming method includes forming a resist film including a first core material pattern and a second core material pattern, on a first film laminated on a substrate; forming a second film at least on sidewalls of the first and second core material patterns; removing the first core material pattern while not removing the second core material pattern and the second film; and processing the first film by using, as a mask, the second core material pattern and the second film.

公开(公告)号：US11796910B2

公开(公告)日：2023-10-24

申请号：US17467016

申请日：2021-09-03

Applicant: Kioxia Corporation

Inventor： Kosuke Takai ,  Shingo Kanamitsu ,  Noriko Sakurai

IPC: G03F7/00 ,  B21D22/02 ,  H01J37/317

CPC classification number: G03F7/0002 ,  B21D22/02 ,  H01J37/3174

Abstract: A template according to the present embodiment is a template used in a lithography process of a semiconductor manufacturing process. A first substrate includes a first face, a second face protruded from a portion of the first face, and a lateral face being a lateral face positioned between the second face and the first face and inclined with respect to the second face at a connection portion to the second face. A first material film is provided at least on the lateral face.

公开(公告)号：US11931923B2

公开(公告)日：2024-03-19

申请号：US17115955

申请日：2020-12-09

Applicant: Kioxia Corporation

Inventor： Takeharu Motokawa ,  Hideaki Sakurai ,  Noriko Sakurai ,  Ryu Komatsu

IPC: G03F7/00 ,  B29C33/38 ,  B29L31/00 ,  H01L21/027

CPC classification number: B29C33/3842 ,  G03F7/0002 ,  B29K2905/08 ,  B29K2907/04 ,  B29L2031/757 ,  H01L21/0271

Abstract: A method of manufacturing a template, has: preparing a substrate containing quartz and having a surface, the surface including a protrusion and a depression; and processing the depression. The processing of the depression includes: a first step of forming a film on the surface, the film including a first region and a second region, the first region being provided on the protrusion, and the second region being provided on a bottom of the depression and being thinner than the first region; a second step of removing the second region with the first region partly remaining to expose the bottom of the depression; and a third step of processing the exposed part of the depression using a mask made of the remainder of the first region.

公开(公告)号：US20230290619A1

公开(公告)日：2023-09-14

申请号：US17902745

申请日：2022-09-02

Applicant: KIOXIA CORPORATION

Inventor： Takeharu MOTOKAWA ,  Noriko Sakurai ,  Hideaki Sakurai

IPC: H01J37/32

CPC classification number: H01J37/32669 ,  H01J37/32532 ,  H01J37/32522

Abstract: According to one embodiment, a plasma treatment apparatus includes a first chamber, an electrode provided in the first chamber and having a surface, and a conveyance mechanism that places a carrier structure holding a treatment target in the first chamber such that a ferromagnetic body of the carrier structure is disposed between the surface of the electrode and the treatment target. The ferromagnetic body has a single polarity within a plane substantially parallel to the surface of the electrode.