公开(公告)号：US20230282456A1

公开(公告)日：2023-09-07

申请号：US17898853

申请日：2022-08-30

Applicant: KIOXIA CORPORATION

Inventor： Tomohiro TAMURA

IPC: H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32568 ,  H01J2237/2007 ,  H01J2237/334 ,  H01J2237/20278 ,  H01J2237/20235

Abstract: According to one embodiment, a plasma processing apparatus generates plasma between a lower electrode and an upper electrode. The plasma processing apparatus includes a processing table, a central top plate, an outer peripheral top plate, and a driver. The processing table is electrically connected to the lower electrode and includes a mounting surface on which a substrate to be treated is mounted. The central top plate is electrically connected to the upper electrode and includes a central surface facing the mounting surface. The outer peripheral top plate is electrically connected to the upper electrode and includes an outer peripheral surface facing the mounting surface and surrounds the outer periphery of the central surface. The driver relatively displaces the central top plate and the outer peripheral top plate.