公开(公告)号：US12112927B2

公开(公告)日：2024-10-08

申请号：US17734572

申请日：2022-05-02

Applicant: Picosun Oy

Inventor： Väinö Kilpi

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01J37/32

CPC classification number: H01J37/32715 ,  C23C16/4409 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/4586 ,  H01J37/32834 ,  H01J37/3288 ,  H01J37/32899 ,  H01J37/3222 ,  H01J2237/20235 ,  H01J2237/332 ,  H01J2237/3321 ,  H01J2237/334 ,  H01J2237/3341

Abstract: A substrate processing apparatus (100), comprising a reaction chamber (50), an outer chamber (80) at least partly surrounding the reaction chamber (50) and forming an intermediate volume (70) therebetween, and a substrate support (40) within the reaction chamber (50), comprising a hollow inner volume (42), wherein the hollow inner volume (42) and the intermediate volume (70) are in fluid communication through a channel (45) extending from the hollow inner volume (42) to the intermediate volume (70).

公开(公告)号：US20240312756A1

公开(公告)日：2024-09-19

申请号：US18674282

申请日：2024-05-24

Applicant: ASML Netherlands B.V.

Inventor： Jasper Hendrik GRASMAN ,  Niels Johannes Maria BOSCH ,  Patrick Peter Hubert Helena PHILIPS ,  Peter Paul HEMPENIUS ,  Joan SANS MERCADER ,  Gerardus Wilhelmus SARS ,  Hans BUTLER ,  Willem Henk URBANUS

IPC: H01J37/20

CPC classification number: H01J37/20 ,  H01J2237/20235

Abstract: Disclosed herein is a platform for a charged particle apparatus, the platform comprising: a base frame; a chamber arranged to comprise a substrate; a metrology frame arranged to support a charged particle beam generator for irradiating a substrate in the chamber with a charged particle beam; and a bellow arranged between the metrology frame and the chamber; wherein: the chamber is rigidly connected to the base frame; the bellow comprises a flexible material such that the metrology frame is substantially isolated from any vibrations that are generated in the chamber; and the bellow is air tight so that a substantial vacuum may be established in the chamber.

公开(公告)号：US20240274411A1

公开(公告)日：2024-08-15

申请号：US18022550

申请日：2021-12-02

Applicant: PSK INC.

Inventor： Kwang Sung YOO ,  Ju Young PARK

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J37/3244 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/32743 ,  H01J2237/2005 ,  H01J2237/20235 ,  H01J2237/334

Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a housing defining a treatment space formed by a combination of an upper housing and a lower housing, a gas supply unit configured to supply gas to the treatment space, a support unit including a chuck configured to support the substrate in the treatment space and an upper electrode provided to surround the check when viewed from a top view, a dielectric plate unit including a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space, and an upper electrode unit coupled to the dielectric plate unit and including an upper electrode arranged to oppose the lower electrode, in which the upper electrode unit is coupled to the lower housing.

公开(公告)号：US12051607B2

公开(公告)日：2024-07-30

申请号：US17257900

申请日：2019-06-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Patriek Adrianus Alphonsus Maria Bruurs ,  Dennis Herman Caspar Van Banning ,  Jan-Gerard Cornelis Van Der Toorn ,  Edwin Cornelis Kadijk

IPC: H01L21/67 ,  G01K1/14 ,  G01K11/125 ,  H01J37/20 ,  H01J37/244 ,  H01L21/68

CPC classification number: H01L21/67248 ,  G01K1/14 ,  G01K11/125 ,  H01J37/20 ,  H01J37/244 ,  H01L21/68 ,  H01J2237/20228 ,  H01J2237/20235

Abstract: A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.

公开(公告)号：US20240213082A1

公开(公告)日：2024-06-27

申请号：US18526061

申请日：2023-12-01

Applicant: NGK INSULATORS, LTD.

Inventor： Hideaki HASHIMOTO ,  Masashi ONO ,  Michihiro ASHIDA

IPC: H01L21/687 ,  H01J37/32

CPC classification number: H01L21/68785 ,  H01J37/32715 ,  H01L21/68757 ,  H01J2237/20235

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface that includes a wafer placement portion, and a plug that is installed in a plug installation hole extending through the ceramic plate in an up-down direction and that allows gas to pass therethrough, wherein the plug has a gas flow path that includes a plurality of linear flow paths that is combined such that the plurality of linear flow paths intersects with each other in a plug body, and wherein the gas flow path includes a plurality of opening portions in an upper surface and a lower surface of the plug body.

公开(公告)号：US20240071713A1

公开(公告)日：2024-02-29

申请号：US18270707

申请日：2021-12-09

Applicant: ASML Netherlands B.V.

Inventor： Niels Johannes Maria BOSCH ,  Xu WANG ,  Peter Paul HEMPENIUS ,  Yongqiang WANG ,  Hans BUTLER ,  Youjin WANG ,  Jasper Hendrik GRASMAN ,  Jianzi SUI ,  Tianming CHEN ,  Aimin WU

IPC: H01J37/20

CPC classification number: H01J37/20 ,  H01J37/28 ,  H01J2237/20235

Abstract: There is provided a charged particle apparatus comprising: a particle beam generator, optics, a first and a second positioning device, both configured for positioning the substrate relative to the particle beam generator along its optical axis, and a controller configured for switching between a first operational mode and a second operational mode. The apparatus is configured, when operating in the first operational mode, for irradiating the substrate by the particle beam at a first landing energy of the particle beam and, when operating in the second operational mode, for irradiating the substrate at a second, different landing energy. When operating in the first operational mode, the second positioning device is configured to position the substrate relative to the particle beam generator at a first focus position of the particle beam and in the second operational mode, to position the substrate at a second, different focus position.

公开(公告)号：US11865591B2

公开(公告)日：2024-01-09

申请号：US17103918

申请日：2020-11-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takamitsu Takayama ,  Junichi Sasaki

IPC: H01J37/32 ,  B08B7/00

CPC classification number: B08B7/0035 ,  H01J37/32715 ,  H01J37/32862 ,  H01J2237/20235

Abstract: A method of cleaning a stage in a plasma processing apparatus including the stage on which a substrate is placed, a lifting mechanism configured to raise and lower the substrate with respect to the stage, and a high-frequency power supply connected to the stage, includes: separating the stage and the substrate from each other using the lifting mechanism; and after the separating the stage and the substrate from each other, removing a deposit deposited on the stage with plasma generated by supplying a high-frequency power from the high-frequency power supply to the stage. In the separating the stage and the substrate from each other, a separation distance between the stage and the substrate is set such that a combined impedance formed around an outer peripheral portion of the stage is lower than a combined impedance formed immediately above a central portion of the stage.

公开(公告)号：US11854772B2

公开(公告)日：2023-12-26

申请号：US17311149

申请日：2019-11-26

Applicant: TOKYO ELECTRON LIMITED ,  TOHOKU UNIVERSITY

Inventor： Masaki Hirayama

IPC: H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32082 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32568 ,  H01J2237/20235

Abstract: A plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, a dielectric plate, an upper electrode, an introduction part, a driving shaft, and an actuator. The stage is provided in the processing container. The dielectric plate is provided above the stage via a space in the processing container. The upper electrode has flexibility, is provided above the dielectric plate, and provides a gap between the dielectric plate and the upper electrode. The introduction part is an introduction part of radio frequency waves that are VHF waves or UHF waves, is provided at a horizontal end portion of the space. The driving shaft is coupled to the upper electrode on a central axial line of the processing container. The actuator is configured to move the driving shaft in a vertical direction.

公开(公告)号：US20230377854A1

公开(公告)日：2023-11-23

申请号：US18313003

申请日：2023-05-05

Applicant: Tokyo Electron Limited

Inventor： Yoichi YAMADA

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/3244 ,  H01J2237/002 ,  H01J2237/20235

Abstract: There is provided a cooling plate comprising: lift pins configured to support a substrate; a placing surface capable of having the substrate placed thereon; and a nozzle disposed in the placing surface and configured to blow an inert gas in a combination of a straight flow and a swirling flow toward the substrate lifted from the placing surface by the lift pins.

公开(公告)号：US20230343552A1

公开(公告)日：2023-10-26

申请号：US18342848

申请日：2023-06-28

Applicant: Applied Materials, Inc.

Inventor： Khokan Chandra Paul ,  Ravikumar Patil ,  Vijet Patil ,  Carlaton Wong ,  Adam J. Fischbach ,  Timothy Franklin ,  Tsutomu Tanaka ,  Canfeng Lai

IPC: H01L21/67 ,  H01L21/683 ,  C23C16/509 ,  C23C16/458 ,  H01J37/32

CPC classification number: H01J37/32091 ,  C23C16/4586 ,  C23C16/509 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/20235

Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.