公开(公告)号：US20140136137A1

公开(公告)日：2014-05-15

申请号：US14152562

申请日：2014-01-10

Applicant: KLA-Tencor Corporation

Inventor： Inna Tarshish-Shapir ,  Yoel Feler ,  Anat Marchelli ,  Berta Dinu ,  Vladimir Levinski ,  Boris Efraty ,  Nuriel Amir ,  Mark Ghinovker ,  Amnon Manassen ,  Sigalit Robinzon

IPC: G01R31/28

CPC classification number: G06K9/522 ,  G01B2210/56 ,  G01N21/4788 ,  G06T7/0004 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/30

Abstract: Methods and systems are provided, which identify specified metrology target abnormalities using selected metrics and classify the identified target abnormalities geometrically to link them to corresponding sources of error. Identification may be carried out by deriving target signals such as kernels from specified regions of interest (ROIs) from corresponding targets on a wafer, calculating the metrics from the target signals using respective functions and analyzing the metrics to characterize the targets.

Abstract translation: 提供了方法和系统，其使用选定的度量来识别指定的计量目标异常，并在几何上对所识别的目标异常进行分类，以将它们链接到相应的误差源。 可以通过从晶片上的相应目标导出来自指定感兴趣区域（ROI）的目标信号（例如来自目标信号的内核）来执行识别，使用各自的功能从目标信号计算度量，并分析用于表征目标的度量。

公开(公告)号：US20170255188A1

公开(公告)日：2017-09-07

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: G05B21/02 ,  G03F7/20

CPC classification number: G05B21/02 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633 ,  H01L21/67288

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

公开(公告)号：US10649447B2

公开(公告)日：2020-05-12

申请号：US15597098

申请日：2017-05-16

Applicant: KLA-Tencor Corporation

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: H01L21/66 ,  G06F19/00 ,  G05B21/02 ,  H01L21/67 ,  G03F7/20

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

公开(公告)号：US10242290B2

公开(公告)日：2019-03-26

申请号：US14152562

申请日：2014-01-10

Applicant: KLA-Tencor Corporation

Inventor： Inna Tarshish-Shapir ,  Yoel Feler ,  Anat Marchelli ,  Berta Dinu ,  Vladimir Levinski ,  Boris Efraty ,  Nuriel Amir ,  Mark Ghinovker ,  Amnon Manassen ,  Sigalit Robinzon

IPC: G01R31/28 ,  G06K9/52 ,  G06T7/00 ,  H01L21/66 ,  G01N21/47

Abstract: Methods and systems are provided, which identify specified metrology target abnormalities using selected metrics and classify the identified target abnormalities geometrically to link them to corresponding sources of error. Identification may be carried out by deriving target signals such as kernels from specified regions of interest (ROIs) from corresponding targets on a wafer, calculating the metrics from the target signals using respective functions and analyzing the metrics to characterize the targets.