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公开(公告)号：US09865047B1
公开(公告)日：2018-01-09
申请号：US14883927
申请日：2015-10-15
Applicant: KLA-Tencor Corporation
Inventor： Haiguang Chen , Jaydeep Sinha , Enrique Chavez , Sathish Veeraraghavan
CPC classification number: G06T7/001 , G06K9/4642 , G06K9/52 , G06K9/6201 , G06K9/6215 , G06K2009/4666 , G06T5/006 , G06T2207/30148
Abstract: Systems and methods for providing improved wafer geometry measurements are disclosed. A wafer geometry measurement system may utilize techniques that enable the wafer geometry measurement system to identify and reduce wafer surface errors caused by structures such as patterns on the wafers being measured. The wafer geometry measurement system may also utilize techniques that enable the wafer geometry measurement system to accurately reconstruct patterned wafer surfaces.
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公开(公告)号：US09702829B1
公开(公告)日：2017-07-11
申请号：US14246895
申请日：2014-04-07
Applicant: KLA-Tencor Corporation
Inventor： Haiguang Chen , Jaydeep Sinha , Sergey Kamensky , Enrique Chavez , Shouhong Tang , Mark Plemmons
IPC: G01B9/02 , G01N21/95 , G01N21/956 , G01B11/30
CPC classification number: G01N21/9501 , G01B11/30 , G01B11/303 , G01B11/306 , G01B2210/56 , G01N21/956
Abstract: Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore, local one-dimensional and/or two-dimensional unwrapping techniques are also disclosed and are utilized in certain embodiments in accordance with the present disclosure to provide height and depth information of the detected defects, further improving the detection capabilities of the measurement systems.
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