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公开(公告)号：US11975411B2
公开(公告)日：2024-05-07
申请号：US17423926
申请日：2020-01-23
申请人： KOKI Company Limited
IPC分类号： B23K35/00 , B23K35/02 , B23K35/362 , C22C13/00
CPC分类号： B23K35/362 , B23K35/025 , C22C13/00
摘要： A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
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公开(公告)号：US20200325326A1
公开(公告)日：2020-10-15
申请号：US16764085
申请日：2018-11-01
申请人： KOKI COMPANY LIMITED
发明人： Takeshi Yahagi , Kazuhiro Yukikata , Koichi Sekiguchi , Yusuke Satoh , Tatsuya Baba , Mitsuyasu Furusawa
IPC分类号： C08L63/00
摘要： Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
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公开(公告)号：US11833621B2
公开(公告)日：2023-12-05
申请号：US17052318
申请日：2019-04-27
申请人： KOKI COMPANY LIMITED
IPC分类号： B23K35/362 , B23K35/36 , B23K35/26 , C22C13/00 , B22F1/10
CPC分类号： B23K35/3616 , B22F1/10 , B23K35/262 , B23K35/362 , B23K35/3612 , C22C13/00
摘要： An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
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公开(公告)号：US20230103270A2
公开(公告)日：2023-03-30
申请号：US17052318
申请日：2019-04-27
申请人： KOKI COMPANY LIMITED
IPC分类号： B23K35/36 , B23K35/362 , B23K35/26 , C22C13/00
摘要： An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
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公开(公告)号：US11806817B2
公开(公告)日：2023-11-07
申请号：US17794283
申请日：2021-09-22
申请人： KOKI Company Limited
发明人： Kazuhiro Yukikata , Takefumi Arai , Yuri Misumi
IPC分类号： B23K35/363 , B23K35/36 , B23K35/02 , B23K35/26 , B23K35/362 , C22C13/00
CPC分类号： B23K35/3613 , B23K35/025 , B23K35/262 , B23K35/362 , C22C13/00
摘要： A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
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公开(公告)号：US11541485B2
公开(公告)日：2023-01-03
申请号：US16615466
申请日：2018-06-29
申请人： KOKI Company Limited
发明人： Kazuhiro Yukikata , Motohide Sasaki
IPC分类号： B23K35/362 , B23K35/36 , H05K3/34
摘要： A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
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公开(公告)号：US11447626B2
公开(公告)日：2022-09-20
申请号：US16764085
申请日：2018-11-01
申请人： KOKI COMPANY LIMITED
发明人： Takeshi Yahagi , Kazuhiro Yukikata , Koichi Sekiguchi , Yusuke Satoh , Tatsuya Baba , Mitsuyasu Furusawa
IPC分类号： H01L21/56 , C08G59/24 , C08G59/50 , C08L63/02 , C09J163/02 , C08L63/00 , C08G59/22 , C08K5/053 , C08K5/09 , C08K5/20
摘要： Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
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公开(公告)号：US20210086317A1
公开(公告)日：2021-03-25
申请号：US17052318
申请日：2019-04-27
申请人： KOKI COMPANY LIMITED
IPC分类号： B23K35/36 , B23K35/362 , B23K35/26 , C22C13/00
摘要： An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
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公开(公告)号：US10702956B2
公开(公告)日：2020-07-07
申请号：US15546868
申请日：2016-02-05
申请人： KOKI Company Limited
IPC分类号： B23K35/36 , C07C69/63 , C07C43/17 , C07C271/28 , C07C43/176 , C07C33/42 , C07C69/76 , C07C271/16 , B23K35/362 , B23K35/26 , C22C13/00
摘要： Provided is a flux activator containing a halogen compound represented by formula 1 below: where X1 and X2 represent different halogen atoms, R1 and R2 are each a group represented by any one of formulas —OH, —O—R3, —O—C(═O)—R4, and —O—C(═O)—NH—R5, R1 and R2 optionally represent the same group or different groups, R3, R4, and R5 are each an aromatic hydrocarbon group having 1 to 18 carbon atoms or an aliphatic hydrocarbon group having 1 to 18 carbon atoms, and R3, R4, and R5 optionally represent the same group or different groups.
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公开(公告)号：US11806818B2
公开(公告)日：2023-11-07
申请号：US17615644
申请日：2020-06-26
申请人： KOKI Company Limited
IPC分类号： B23K35/362 , B23K35/36 , B23K35/02
CPC分类号： B23K35/362 , B23K35/3613 , B23K35/025
摘要： A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
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