公开(公告)号：US20140020937A1

公开(公告)日：2014-01-23

申请号：US13918401

申请日：2013-06-14

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Young Hwan KIM ,  Hyuck Ki HONG ,  Dong Sun KIM ,  Tae Ho HWANG ,  Jae Gi SON

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0298 ,  H05K1/038 ,  H05K3/10 ,  H05K3/4685 ,  H05K2201/0162 ,  H05K2201/09245

Abstract: Fabrics with a multi-layered circuit of high reliability and a manufacturing method thereof are provided. The fabrics with the multi-layered circuit include: a base layer; a first conductive pattern which is formed on the base layer; a second conductive pattern which is formed to intersect with the first conductive pattern at least in part; and an insulating pattern which is formed on an intersection portion which is a region where the first conductive pattern and the second conductive pattern intersect.

Abstract translation: 提供具有高可靠性的多层电路的织物及其制造方法。 具有多层电路的织物包括：基层; 形成在基底层上的第一导电图案; 形成为与所述第一导电图案至少部分相交的第二导电图案; 以及形成在第一导电图案和第二导电图案相交的区域的交叉部分上的绝缘图案。