公开(公告)号：US10115635B2

公开(公告)日：2018-10-30

申请号：US15423602

申请日：2017-02-03

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

IPC: B23K1/00 ,  H01L21/768 ,  H01L23/48 ,  B23K3/06 ,  B23K1/20 ,  B23K3/08 ,  B23K101/40

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

公开(公告)号：US20180301377A9

公开(公告)日：2018-10-18

申请号：US15423602

申请日：2017-02-03

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Sehoon Yoo ,  Chang Woo LEE ,  Jun Ki KIM ,  Jeong Han KIM ,  Young Ki KO

IPC: H01L21/768 ,  H01L23/48 ,  B23K1/00 ,  B23K3/06

CPC classification number: H01L21/76898 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/06 ,  B23K3/0646 ,  B23K3/087 ,  B23K2101/40 ,  H01L23/481

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.