公开(公告)号：US20190388970A1

公开(公告)日：2019-12-26

申请号：US16158492

申请日：2018-10-12

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Kang Min Kim ,  Gun Hee Kim ,  Byoung Soo Lee ,  Hyung Giun Kim ,  O Hyung Kwon ,  Kyung Hwan Jung ,  Won Rae Kim ,  Min Ji Ham ,  Kyung Hoon Kim ,  Chang Woo Lee

IPC: B22F3/11 ,  B22F3/105 ,  A61L27/56 ,  A61F2/30 ,  A61L27/06

Abstract: An exemplary embodiment provides a method of manufacturing a curved porous component having a base material layer and a porous region through one-step laminated-molding, whereby it is possible to reduce a manufacturing time when manufacturing a product and to provide a porous component in which the shape and size of a porous region can be controlled. An implant including the porous component has an increased bone contact ratio, so bone growth between bones can be improved and products fitting to the frames of patients can be easily designed.

公开(公告)号：US09539970B2

公开(公告)日：2017-01-10

申请号：US14429591

申请日：2013-09-23

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  SIN YEONG CO., LTD.

Inventor： Jun Ki Kim ,  Chang Woo Lee ,  Se Hoon Yoo ,  Jung Hwan Bang ,  Yong Ho Ko ,  Jeong Han Kim ,  Jong Dock Seo ,  Dea Keun Kim ,  Kwang Woo Won

IPC: B60R21/0136 ,  B62D25/04 ,  B60R21/16 ,  B60R21/017 ,  G01L1/22 ,  B60R21/34 ,  B60R21/01 ,  B60R21/0132

CPC classification number: B60R21/0136 ,  B60R21/0132 ,  B60R21/017 ,  B60R21/16 ,  B60R21/34 ,  B60R2021/01006 ,  B60R2021/01088 ,  B60R2021/01211 ,  B62D25/04 ,  G01L1/22

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract translation: 气囊传感器模块本发明涉及一种气囊传感器模块，其用于检测汽车车身的变形量，以便检测在汽车碰撞期间的碰撞并以粘合方式安装在车身上，并且将车体与 气囊传感器模块。 本申请的一个实施例公开了以粘合方式安装的气囊传感器模块，包括：以基本粘合方式附接到车体的主基板; 以及碰撞检测传感器部分，其形成在主基板上，并且通过包括用于测量变形量的应变传感器来检测轿厢主体是否与由于其碰撞引起的车身变形一起变形而发生碰撞。

公开(公告)号：US10115635B2

公开(公告)日：2018-10-30

申请号：US15423602

申请日：2017-02-03

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Sehoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Young Ki Ko

IPC: B23K1/00 ,  H01L21/768 ,  H01L23/48 ,  B23K3/06 ,  B23K1/20 ,  B23K3/08 ,  B23K101/40

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

公开(公告)号：US09156111B2

公开(公告)日：2015-10-13

申请号：US14558089

申请日：2014-12-02

Applicant: MK ELECTRON CO., LTD. ,  HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Sung Jae Hong ,  Keun Soo Kim ,  Chang Woo Lee ,  Jung Hwan Bang ,  Yong Ho Ko ,  Hyuck Mo Lee ,  Jae Won Chang ,  Ja Hyun Koo ,  Jeong Tak Moon ,  Young Woo Lee ,  Won Sik Hong ,  Hui Joong Kim ,  Jae Hong Lee

IPC: H01L23/48 ,  H01L21/44 ,  B23K31/00 ,  B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  B23K1/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract translation: 提供了一种无铅焊料，焊膏和半导体器件，更具体地，包括在约0.1重量％至约0.8重量％范围内的Cu的无铅焊料，Pd在约0.001 重量％至约0.1重量％，Al在约0.001重量％至约0.1重量％的范围内，Si在约0.001重量％至约0.1重量％的范围内，Sn和不可避免的杂质作为余量，焊膏和 包括无铅焊料的半导体器件。 无铅焊料和焊膏环保，具有高温稳定性和高可靠性。

公开(公告)号：US20150232051A1

公开(公告)日：2015-08-20

申请号：US14429591

申请日：2013-09-23

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  SIN YEONG CO., LTD.

Inventor： Jun Ki Kim ,  Chang Woo Lee ,  Se Hoon Yoo ,  Jung Hwan Bang ,  Yong Ho Ko ,  Jeong Han Kim ,  Jong Dock Seo ,  Dea Keun Kim ,  Kwang Woo Woo

IPC: B60R21/0136 ,  G01L1/22 ,  B60R21/017 ,  B62D25/04 ,  B60R21/16

CPC classification number: B60R21/0136 ,  B60R21/0132 ,  B60R21/017 ,  B60R21/16 ,  B60R21/34 ,  B60R2021/01006 ,  B60R2021/01088 ,  B60R2021/01211 ,  B62D25/04 ,  G01L1/22

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract translation: 气囊传感器模块本发明涉及一种气囊传感器模块，其用于检测汽车车身的变形量，以便检测在汽车碰撞期间的碰撞并以粘合方式安装在车身上，并且将车体与 气囊传感器模块。 本申请的一个实施例公开了以粘合方式安装的气囊传感器模块，包括：以基本粘合方式附接到车体的主基板; 以及碰撞检测传感器部分，其形成在主基板上，并且通过包括用于测量变形量的应变传感器来检测轿厢主体是否与由于其碰撞引起的车身变形一起变形而发生碰撞。