公开(公告)号：US20190388971A1

公开(公告)日：2019-12-26

申请号：US16158512

申请日：2018-10-12

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Kyung Hwan JUNG ,  Gun Hee KIM ,  Byoung Soo LEE ,  Hyung Giun KIM ,  Seung Min YANG ,  Kang Min KIM ,  Won Rae KIM ,  Min Ji HAM ,  Kyung Hoon KIM ,  Chang Woo LEE

IPC: B22F3/11 ,  B22F3/105 ,  A61L27/56 ,  A61F2/30 ,  A61L27/06

Abstract: An exemplary embodiment provides a method of manufacturing a porous component having a base material layer and a porous layer through one-step laminated-molding, whereby it is possible to provide a manufacturing time when manufacturing a product and to provide a porous component in which the shape and size of a porous layer can be controlled. An implant including the porous component has an increased bone contact ratio, so bone growth between bones can be improved and products fitting to the frames of patients can be easily designed.

公开(公告)号：US20180301377A9

公开(公告)日：2018-10-18

申请号：US15423602

申请日：2017-02-03

Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

Inventor： Sehoon Yoo ,  Chang Woo LEE ,  Jun Ki KIM ,  Jeong Han KIM ,  Young Ki KO

IPC: H01L21/768 ,  H01L23/48 ,  B23K1/00 ,  B23K3/06

CPC classification number: H01L21/76898 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/06 ,  B23K3/0646 ,  B23K3/087 ,  B23K2101/40 ,  H01L23/481

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

公开(公告)号：US20150151386A1

公开(公告)日：2015-06-04

申请号：US14558089

申请日：2014-12-02

Applicant: MK ELECTRON CO., LTD. ,  HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Sung Jae HONG ,  Keun Soo KIM ,  Chang Woo LEE ,  Jung Hwan BANG ,  Yong Ho KO ,  Hyuck Mo LEE ,  Jae Won CHANG ,  Ja Hyun KOO ,  Jeong Tak MOON ,  Young Woo LEE ,  Won Sik HONG ,  Hui Joong KIM ,  Jae Hong LEE

IPC: B23K35/26 ,  H01L23/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  B23K2101/40 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract translation: 提供了一种无铅焊料，焊膏和半导体器件，更具体地，包括在约0.1重量％至约0.8重量％范围内的Cu的无铅焊料，Pd在约0.001 重量％至约0.1重量％，Al在约0.001重量％至约0.1重量％的范围内，Si在约0.001重量％至约0.1重量％的范围内，Sn和不可避免的杂质作为余量，焊膏和 包括无铅焊料的半导体器件。 无铅焊料和焊膏环保，具有高温稳定性和高可靠性。