Patent search ap:("KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY") AND inv:"S. Joon Kwon" Page 1

1.

发明授权
Integrated photoacoustic gas sensor and method for manufacturing the same 有权

公开(公告)号：US11639891B2

公开(公告)日：2023-05-02

申请号：US17498755

申请日：2021-10-12

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Joonhyun Kang , Il Ki Han , S. Joon Kwon , Young Min Jhon

IPC: G01N21/17 , G01N33/00

Abstract: The present disclosure relates to a photoacoustic gas sensor for detecting the presence or absence of gas using the interaction of a laser beam and gas molecules. The integrated photoacoustic gas sensor according to an embodiment includes a light output unit; a lens unit configured to concentrate a laser beam output from the light output unit; and a photoacoustic sensing unit having a quartz tuning fork aligned on the lens unit and configured to convert a vibration, generated when the laser beam passing through the lens unit interacts with gas molecules, into an electric signal.

2.

发明授权
Method and apparatus for surface planarization of object using light source of specific wavelength and reactive gas 有权

公开(公告)号：US10964550B2

公开(公告)日：2021-03-30

申请号：US16270594

申请日：2019-02-08

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Gumin Kang , Il Ki Han , S. Joon Kwon , Young-Hwan Kim , Hyungduk Ko , Chun Keun Kim

IPC: H01L21/321 , H01L21/66 , H01L21/3105 , H01L21/306

Abstract: A method for surface planarization of an object using a light source of a specific wavelength according to an embodiment includes: providing an object in a main chamber; injecting an etching gas into the main chamber; inputting the light source of a specific wavelength onto a surface of the object; and controlling a temperature of the object. According to the method, it is possible to minimize the side effects such as scratches or contamination of the sample that occur in a conventional chemical-mechanical planarization process. In addition, it is possible to allow precise planarization in nanometers (nm) and simultaneously perform planarization to a side surface of a device as well as a large-sized surface, thereby reducing cost and time required for the planarization process. Moreover, since the surface roughness and the electrical conductivity are improved, it is possible to increase the efficiency and output of the LED device.

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