公开(公告)号：US10685762B2

公开(公告)日：2020-06-16

申请号：US15990824

申请日：2018-05-29

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji-Won Choi ,  Jin Sang Kim ,  Chong Yun Kang ,  Seong Keun Kim ,  Seung Hyub Baek ,  Sang Tae Kim ,  Won Jae Lee ,  Narendra Singh Parmar ,  Young-Shin Lee

IPC: H01B1/22 ,  H01L29/20 ,  H01L21/288 ,  H01L21/285 ,  H01L29/45 ,  C08L29/04 ,  C08K3/22

Abstract: The present disclosure relates to a paste for ohmic contact to p-type semiconductor, including a metal oxide and a binder, wherein the metal oxide is a rhenium oxide or a molybdenum oxide.