公开(公告)号：US20230059100A1

公开(公告)日：2023-02-23

申请号：US17835349

申请日：2022-06-08

Applicant: KTX CORPORATION

Inventor： Katsuya SATO

IPC: B29C51/40 ,  B29C33/38 ,  B29C51/36

Abstract: A molding mold includes a shell mold provided with a plurality of vacuum suction holes and a backup mold for backing up the shell mold, a back surface of the shell mold and a front surface of the backup mold having the same shape and being fitted to each other. A ventilation groove is formed on the front surface of the backup mold or the back surface of the shell mold, leaving a receiving surface for receiving a mating surface, a plurality of striped grooves and ridges between the striped grooves are formed on the back surface of the shell mold or the front surface of the backup mold, the striped grooves having a feed pitch of 0.5 mm to 5.0 mm and a processing depth of 0.01 mm to 0.4 mm, and the vacuum suction holes and the ventilation groove communicate with each other through the striped grooves.

公开(公告)号：US20190337191A1

公开(公告)日：2019-11-07

申请号：US16517908

申请日：2019-07-22

Applicant: KTX CORPORATION

Inventor： Katsuya SATO

IPC: B29C33/04 ,  C25D7/04 ,  C25D1/02 ,  B29C33/56 ,  B29C45/73 ,  B29C33/38 ,  C25D1/08 ,  C25D1/00 ,  B29C33/00 ,  C25D1/10

Abstract: A method for manufacturing a mold includes forming a groove in a back surface of a mold body configured to mold a resin or a rubber by cutting or by electrical discharge machining the back surface of the mold body, placing a porous conductive sheet, including a plurality of through holes and being conductive at least at a surface of the porous conductive sheet, on the back surface of the mold body so as to cover the groove, and temporarily fixing the porous conductive sheet to the back surface of the mold body by spot welded portions, wherein a part of the porous conductive sheet which covers the groove has a flat shape, and performing electroforming to cause an electroformed metal to be electrodeposited on the back surface of the mold body and on the porous conductive sheet.

公开(公告)号：US20170106567A1

公开(公告)日：2017-04-20

申请号：US15265727

申请日：2016-09-14

Applicant: KTX CORPORATION

Inventor： Katsuya SATO

IPC: B29C33/04 ,  C25D1/08 ,  C25D1/10 ,  B29C33/00 ,  B29C33/38

CPC classification number: B29C33/04 ,  B29C33/0083 ,  B29C33/3842 ,  B29C33/56 ,  B29C45/7312 ,  B29C2045/7325 ,  B29K2905/00 ,  B29K2995/0005 ,  C25D1/00 ,  C25D1/02 ,  C25D1/08 ,  C25D1/10 ,  C25D7/04

Abstract: A mold includes a mold body, a porous conductive sheet and an electroformed metal. The porous conductive sheet is placed on a back surface of the mold body, has a plurality of through holes, and is conductive at least at its surface. The electroformed metal is electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet. In the mold, an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.