摘要:
A method of fabricating a semiconductor device, comprising: forming a plurality of memory cell strings; coupling an interconnection to at least two of the memory cell strings; and coupling a bitline to the interconnection. The interconnection includes a body extending along a first direction and a protrusion protruding from the body along a second direction.
摘要:
A semiconductor device includes an active region, a gate pattern on the active region, the active region including a source region at a first side of the gate pattern and a drain region at a second side of the gate pattern, a gate contact pattern on the gate pattern and a drain contact pattern on the drain region, and a gate stud pattern on the gate contact pattern and a drain stud pattern on the drain contact pattern. A distance between a gate contact axis passing through a center portion of the gate contact pattern and a drain contact axis passing through a center portion of the drain contact pattern is different from a distance between a gate stud axis passing through a center portion of the gate stud pattern and a drain stud axis passing through a center portion of the drain stud pattern.
摘要:
A semiconductor device may include an insulating layer provided in one body on a substrate, a first gate electrode and a second gate electrode disposed on the insulating layer, the first and second gate electrodes extending in a first direction parallel to a top surface of the substrate, a first channel structure penetrating the first gate electrode and the insulating layer so as to be connected to the substrate, a second channel structure penetrating the second gate electrode and the insulating layer so as to be connected to the substrate, and a contact penetrating the insulating layer between the first gate electrode and the second gate electrode. The contact may be connected to a common source region formed in the substrate, and the common source region may have a first conductivity type. Further, the first gate electrode and the second gate electrode may be spaced apart from each other in a second direction at the same level from the substrate, wherein the second direction intersects the first direction and is parallel to the top surface of the substrate.
摘要:
A semiconductor device includes a substrate with an active region defined by a device isolation layer. A word line extends over the active region in a first direction, and a plurality of interconnections extends over the word line in a second direction perpendicular to the first direction. A contact pad is disposed between and spaced apart from the word line and the plurality of interconnections, extending in the first direction to overlap the plurality of interconnections and the active region when viewed from a plan view. A lower contact plug electrically connects the contact pad to the active region. An upper contact plug electrically connects the contact pad to one of the plurality of interconnections.