公开(公告)号：US20040140550A1

公开(公告)日：2004-07-22

申请号：US10706307

申请日：2003-11-12

Applicant: KYOCERA CORPORATION

Inventor： Katsuyuki Yoshida

IPC: H01L023/053

CPC classification number: H05K1/0243 ,  H01L23/49805 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H05K3/3421 ,  H05K2201/10689 ,  H05K2201/10946 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high-frequency package comprises a dielectric substrate, on an upper face of which a mounting portion of a high-frequency circuit component is formed, a first line conductor formed on the upper face for transmitting high-frequency signals, a first coplanar grounding conductor, a second line conductor formed on a lower face, a second coplanar grounding conductor, a through conductor formed inside for connecting the first and second line conductors, a grounding through conductor connecting the first and second coplanar grounding conductors, a metal terminal bonded to the second line conductor, and grounding metal terminals bonded to the second coplanar grounding conductor, wherein a gap between the grounding metal terminals is equal to or less than null of a wavelength of high-frequency signals.

Abstract translation: 高频组件包括介电衬底，其上表面上形成有高频电路部件的安装部分，形成在上表面上用于传输高频信号的第一线导体，第一共面接地导体 ，形成在下表面上的第二线导体，第二共面接地导体，形成在内部用于连接第一和第二线导体的通孔导体，连接第一和第二共面接地导体的接地导体， 第二线路导体和接地金属端子接合到第二共面接地导体，其中接地金属端子之间的间隙等于或小于高频信号波长的1/2。