公开(公告)号：US20190024991A1

公开(公告)日：2019-01-24

申请号：US15755604

申请日：2016-08-26

申请人： KYOCERA CORPORATION

发明人： Kiyotaka Nakamura ,  Masayuki Moriyama ,  Yuusaku Ishimine

IPC分类号： F28F21/04 ,  F28F1/04 ,  F28F3/12 ,  F28F19/02

摘要： In the present disclosure, a flow path member includes a substrate, a flow path and a first oxide layer. The substrate contains non-oxide ceramics, and includes an outer surface. The flow path is in the substrate, and includes an inlet and an outlet. The first oxide layer is disposed on the outer surface.

公开(公告)号：US09161444B2

公开(公告)日：2015-10-13

申请号：US14354600

申请日：2012-09-28

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/00 ,  H05K1/09 ,  H05K3/38 ,  H01L23/15 ,  C04B41/90 ,  C04B41/00 ,  C04B41/52 ,  H05K1/03 ,  H01L23/373 ,  C04B111/00

CPC分类号： H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.

摘要翻译： 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下， 并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

公开(公告)号：US20140284088A1

公开(公告)日：2014-09-25

申请号：US14354600

申请日：2012-09-28

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/09

CPC分类号： H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.

摘要翻译： 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下， 并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

公开(公告)号：US11554992B2

公开(公告)日：2023-01-17

申请号：US16320427

申请日：2017-07-27

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Masayuki Moriyama

IPC分类号： B32B17/06 ,  C04B37/00

摘要： The bonded ceramic assembly of the present disclosure includes a first substrate made of ceramic, a second substrate made of ceramic, and a bonding layer positioned between the first substrate and the second substrate. The bonding layer contains aluminum, at least one of calcium and magnesium, a rare earth element, silicon, and oxygen. Out of a total 100 mass % of all of the components making up the bonding layer, the bonding layer contains from 33 mass % to 65 mass % aluminum in terms of oxide, a total of from 27 mass % to 60 mass % calcium and magnesium in terms of oxide, and from 2 mass % to 12 mass % rare earth element in terms of oxide. The silicon content, in terms of oxide, of the surface of the bonding layer is greater than the silicon content, in terms of oxide, of the interior of the bonding layer.

公开(公告)号：US10689300B2

公开(公告)日：2020-06-23

申请号：US15763457

申请日：2016-09-28

申请人： KYOCERA CORPORATION

发明人： Kiyotaka Nakamura ,  Masayuki Moriyama

IPC分类号： C04B37/00 ,  B32B18/00

摘要： A ceramic bonded body of the disclosure includes a first silicon carbide ceramics, a second silicon carbide ceramics, and a bonding layer positioned between the first silicon carbide ceramics and the second silicon carbide ceramics. The bonding layer contains 25 mass % or more metallic silicon, and 25 mass % or more silicon carbide assuming all components constituting the bonding layer as 100 mass %, and a total of the metallic silicon and the silicon carbide is 75 mass % or more, and the bonding layer further contains at least one of nickel silicide and chromium silicide.

公开(公告)号：US10684081B2

公开(公告)日：2020-06-16

申请号：US15755604

申请日：2016-08-26

申请人： KYOCERA CORPORATION

发明人： Kiyotaka Nakamura ,  Masayuki Moriyama ,  Yuusaku Ishimine

IPC分类号： F28F21/04 ,  C04B41/80 ,  F28F3/12 ,  F28F1/04 ,  F28F19/02

摘要： In the present disclosure, a flow path member includes a substrate, a flow path and a first oxide layer. The substrate contains non-oxide ceramics, and includes an outer surface. The flow path is in the substrate, and includes an inlet and an outlet. The first oxide layer is disposed on the outer surface.