公开(公告)号：US09980384B2

公开(公告)日：2018-05-22

申请号：US14407405

申请日：2013-06-21

申请人： KYOCERA Corporation

发明人： Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  C04B37/02 ,  H05K1/11

CPC分类号： H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

摘要： The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

公开(公告)号：US09161444B2

公开(公告)日：2015-10-13

申请号：US14354600

申请日：2012-09-28

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/00 ,  H05K1/09 ,  H05K3/38 ,  H01L23/15 ,  C04B41/90 ,  C04B41/00 ,  C04B41/52 ,  H05K1/03 ,  H01L23/373 ,  C04B111/00

CPC分类号： H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.

摘要翻译： 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下， 并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

公开(公告)号：US11987529B2

公开(公告)日：2024-05-21

申请号：US17266032

申请日：2019-08-06

申请人： KYOCERA Corporation

发明人： Satoshi Kiyota ,  Kazuo Watada ,  Takehisa Higa ,  Masamichi Shingu ,  Kunihide Shikata

IPC分类号： C04B35/10 ,  G02B5/00 ,  F21S41/40 ,  G01J5/06

CPC分类号： C04B35/10 ,  G02B5/003 ,  C04B2235/3217 ,  C04B2235/3237 ,  C04B2235/3241 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/9661 ,  F21S41/40 ,  G01J5/06 ,  G01J2005/065

摘要： The light shielding member of the present disclosure includes an aluminum oxide ceramics including an oxide of titanium whose composition formula is shown as TiO2-x (1≤x

公开(公告)号：US20140284088A1

公开(公告)日：2014-09-25

申请号：US14354600

申请日：2012-09-28

申请人： KYOCERA Corporation

发明人： Kiyotaka Nakamura ,  Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/09

CPC分类号： H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.

摘要翻译： 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下， 并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

公开(公告)号：US20150144385A1

公开(公告)日：2015-05-28

申请号：US14407405

申请日：2013-06-21

申请人： KYOCERA Corporation

发明人： Yoshio Ohashi ,  Kunihide Shikata

IPC分类号： H05K1/18 ,  H05K1/09 ,  H05K1/03

CPC分类号： H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

摘要： The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

摘要翻译： 电路基板包括陶瓷烧结体和在其至少一个主表面上设置有玻璃层的金属布线层，并且当观察到垂直于陶瓷烧结体的主表面的电路板的横截面时， 玻璃层和金属布线层之间的界面的长度与沿着主表面的方向上的玻璃层的长度的比率为1.25至1.80。