公开(公告)号：US20200025341A1

公开(公告)日：2020-01-23

申请号：US16510736

申请日：2019-07-12

Applicant: KYOTO UNIVERSITY ,  STANLEY ELECTRIC CO., LTD.

Inventor： Shunsuke MURAI ,  Yusuke YOKOBAYASHI ,  Yasuyuki KAWAKAMI ,  Keijiro TAKASHIMA ,  Syousaku KUBO ,  Yosuke MAEMURA

IPC: F21K9/64 ,  F21K9/65 ,  F21K9/68

Abstract: A wavelength conversion device includes: a wavelength conversion element having a phosphor plate that converts the wavelength of incident light upon a light incident surface to generate wavelength-converted light, and emits the wavelength-converted light from a light emission surface; an antenna array constituted of a plurality of optical antennas that are periodically arranged on the light emission surface of the phosphor plate; and a recessed structure including at least one recessed portion provided in the light emission surface of the phosphor plate.

公开(公告)号：US20230080194A1

公开(公告)日：2023-03-16

申请号：US17797885

申请日：2021-02-05

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Yusuke YOKOBAYASHI ,  Yasuyuki KAWAKAMI ,  Yosuke MAEMURA ,  Hideaki YAMAMOTO ,  Keijiro TAKASHIMA ,  Ryosuke KAMAKURA

IPC: F21V7/30 ,  F21V9/35 ,  F21K9/64 ,  H01S5/0239

Abstract: An optical device includes a metal reflective layer substantially made of a metal material, a first light transmissive layer disposed on the metal reflective layer, an optical multilayer reflective film disposed on the first light transmissive layer and including a plurality of sublayers stacked on each other and having different refractive indexes, and a wavelength converting layer disposed on the optical multilayer reflective film and containing a fluorescent material capable of absorbing incident excitation light and generating fluorescent light having a lower energy. The wavelength converting layer is capable of generating mixed light containing the excitation light and the fluorescent light in response to irradiation with the excitation light.

公开(公告)号：US20170244220A1

公开(公告)日：2017-08-24

申请号：US15439583

申请日：2017-02-22

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Philip RACKOW ,  Yusuke YOKOBAYASHI ,  Keijiro TAKASHIMA

IPC: H01S5/32 ,  H01S5/042

CPC classification number: H01S5/3202 ,  H01S5/0202 ,  H01S5/0203 ,  H01S5/0425 ,  H01S5/2201 ,  H01S5/2202 ,  H01S5/24 ,  H01S5/32341

Abstract: A method for manufacturing a semiconductor light-emitting device includes: forming a plurality of guide grooves so as to be depressed from a surface of a semiconductor structure layer toward a semiconductor substrate and to align and extend along a direction perpendicular to an extending direction of a plurality of line electrodes; forming, in each of the plurality of guide grooves, a scribe groove so as to be depressed from a bottom surface of the guide groove toward the semiconductor substrate and to extend along an extending direction of the guide groove; and dividing a semiconductor wafer along the plurality of guide grooves. The guide groove and the scribe groove are formed to have end shapes in such a manner that inner walls thereof project toward each other in the extending direction of the scribe groove.