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公开(公告)号：US20120217290A1
公开(公告)日：2012-08-30
申请号：US13438213
申请日：2012-04-03
申请人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
发明人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
IPC分类号： B23K1/20 , B23K35/363
CPC分类号： B23K35/362 , B23K1/0016 , B23K35/262 , B23K35/3601 , B23K35/3612 , B23K35/3618
摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明涉及助焊剂组合物及其用途。 一种组合物包含活化剂和溶剂，其分子量为200-500的甘油乙氧基化物。 另一组合物包含活化剂，溶剂为分子量为200-500的甘油乙氧基化物和胺。 还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。
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公开(公告)号：US20130001279A1
公开(公告)日：2013-01-03
申请号：US13613000
申请日：2012-09-13
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明还涉及一种用于接合物体的焊接方法，其包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分上并连接物体。
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公开(公告)号：US09808874B2
公开(公告)日：2017-11-07
申请号：US13613000
申请日：2012-09-13
IPC分类号： B23K1/00 , B23K35/36 , B23K35/362
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
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公开(公告)号：US09815149B2
公开(公告)日：2017-11-14
申请号：US13438213
申请日：2012-04-03
申请人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
发明人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
IPC分类号： B23K35/362 , B23K35/36 , B23K1/00 , B23K35/26
CPC分类号： B23K35/362 , B23K1/0016 , B23K35/262 , B23K35/3601 , B23K35/3612 , B23K35/3618
摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
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公开(公告)号：US09579738B2
公开(公告)日：2017-02-28
申请号：US13034932
申请日：2011-02-25
IPC分类号： B23K1/00 , B23K35/36 , B23K35/362
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.
摘要翻译： 本发明涉及助焊剂组合物。 一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。 另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。 另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。 另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。
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公开(公告)号：US20120217289A1
公开(公告)日：2012-08-30
申请号：US13034932
申请日：2011-02-25
IPC分类号： B23K35/363 , B23K1/20
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明涉及助焊剂组合物及其用途。 一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。 另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。 另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。 另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。 还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。
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公开(公告)号：US08444774B2
公开(公告)日：2013-05-21
申请号：US12731369
申请日：2010-03-25
申请人： Eric Duschesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duschesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B23K35/34
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US20100175790A1
公开(公告)日：2010-07-15
申请号：US12731369
申请日：2010-03-25
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US20080124568A1
公开(公告)日：2008-05-29
申请号：US11493724
申请日：2006-07-26
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B32B15/01 , B23K1/00 , B23K35/363
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US07780801B2
公开(公告)日：2010-08-24
申请号：US11493724
申请日：2006-07-26
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B23K35/28
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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