摘要:
A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.
摘要:
A pattern inspection method and apparatus are provided for sequentially imaging plural chips formed on a substrate to be inspected to and obtaining inspection images and reference images, calculating a position gap between the inspection images and the reference images using a recipe created in advance by using another substrate of the same kind or type as the substrate, the recipe including information for determining which pattern sections are to be selected and discarded, aligning the inspection images and the reference images using information of the position gap from the calculating step, and comparing the inspection images with the reference images aligned by the aligning step and extracting a defect candidate.
摘要:
A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate.
摘要:
A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.
摘要:
A pattern inspection method including: sequentially imaging plural chips formed on a substrate; selecting a pattern which is suitable for calculating position gap between an inspection image of a subject chip and reference image stored in memory from an image of a firstly imaged chip among said sequentially imaged plural chips formed on the substrate; computing position gap between an inspection image of a chip obtained by the sequential imaging and reference image stored in a memory by using a positional information of a pattern image included in the inspection image and a reference pattern image included in the reference image which are both corresponding to the pattern selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image and extracting a difference as a defect candidate.
摘要:
A fixed-amount discharge squeeze container (10) which discharges a specific amount of content liquid from a discharge port by squeeze deformation of a container body (11) includes a squeeze-deformable plastic-made container body (11) and a squeeze operating portion (14) to perform squeeze operation is arranged at a barrel portion (13) of the container body (11). The squeeze operating portion (14) has a cross-sectional shape formed with a compression face portion (16) having a mountain-like section including a pair of inclined face portions (15) arranged along two faces intersecting obtusely and a compression support portion (18) having an arc-shaped section which is jointed integrally with foot parts (19b) of the compression face portion (16) respectively via an edge line portion (17). The compression face portion (16) is restricted so as not to be flipped into a valley-like shape after the inclined face portions (15) deforms until force to expand the distance between the bilateral foot parts (19b) vanishes.
摘要:
An image forming method of the present invention including applying a pretreatment liquid to a recording medium, and discharging an inkjet recording ink dropwise according to an image signal to form an image on the recording medium on which the pretreatment liquid has been applied, wherein the recording medium is regular paper which has no coat layer, the pretreatment liquid contains a cationic polymer compound, a surfactant A, water and a water-soluble organic acid, and the inkjet recording ink contains a water-dispersible colorant, a water-soluble organic solvent, a surfactant B, a penetrating agent and water, and wherein the pretreatment liquid has a static surface tension of 20 mN/m to 30 mN/m.
摘要:
An image forming method including: applying a pre-treatment liquid onto a coating layer provided on at least one surface of a support of a recording medium, jetting an inkjet ink onto the coating layer, onto which the pre-treatment liquid has been applied, so as to form an image, and applying or jetting a post-treatment liquid onto the coating layer, onto which the inkjet ink has been jetted, so as to form a transparent protective layer on the coating layer, wherein the inkjet ink contains the water-dispersible colorant, a water-soluble organic solvent, a surfactant, a penetrant and water, and wherein an amount of pure water transferred into the recording medium, provided with the coating layer, measured at a contact time of 100 ms with a dynamic scanning liquid absorptometer is 1 ml/m2 to 10 ml/m2, and the pre-treatment liquid contains a water-soluble aliphatic organic acid.
摘要翻译:一种图像形成方法,包括:将预处理液体施加到设置在记录介质的支撑体的至少一个表面上的涂层上,将喷墨油墨喷射到涂覆有预处理液体的涂层上, 以便形成图像,并且将后处理液体施加或喷射到已经喷射了喷墨油墨的涂层上,以在涂层上形成透明保护层,其中喷墨油墨含有水 可分散着色剂,水溶性有机溶剂,表面活性剂,渗透剂和水,并且其中转移到记录介质中的设置有涂层的纯水量在100ms的接触时间下用动态扫描 液体吸收计为1ml / m 2至10ml / m 2,预处理液含有水溶性脂肪族有机酸。
摘要:
A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
摘要:
Provided are an oxide sintered body and a sputtering target that are ideal for the production of an oxide semiconductor film for a display device. The oxide sintered body and sputtering target that are provided have both high conductivity and high relative density, are capable of forming an oxide semiconductor film having a high carrier mobility, and in particular, have excellent direct-current discharge stability in that long-term, stable discharge is possible, even when used by the direct-current sputtering method. The oxide sintered body of the invention is an oxide sintered body obtained by mixing and sintering zinc oxide, tin oxide, and an oxide of at least one metal (M metal) selected from the group consisting of Al, Hf, Ni, Si, Ga, In, and Ta. When the in-plane specific resistance and the specific resistance in the direction of depth are approximated by Gaussian distribution, the distribution coefficient σ of the specific resistance is 0.02 or less.