摘要:
In a sound reproducing apparatus, part of a frequency band where mode-coupled vibration can be excited is regarded as a carrier frequency. A frequency of mode coupling, with a low rate of change in vibration displacement with respect to the frequency, is regarded as a carrier signal so that a signal in an audible band which is outputted from an audible band signal source can be demodulated and reproduced with stable sound pressure in a broad frequency band.
摘要:
In a sound reproducing apparatus, part of a frequency band where mode-coupled vibration can be excited is regarded as a carrier frequency. A frequency of mode coupling, with a low rate of change in vibration displacement with respect to the frequency, is regarded as a carrier signal so that a signal in an audible band which is outputted from an audible band signal source can be demodulated and reproduced with stable sound pressure in a broad frequency band.
摘要:
A sound reproduction apparatus reproduces a sound wave at a listening position. The sound reproduction apparatus includes a compensation processing unit for compensating an audible band signal having an audible band frequency, a carrier signal oscillator for generating a carrier signal, a modulator for outputting a modulated signal obtained by modulating the carrier signal based on the audible band signal compensated by the compensation processing unit, and a sound emission unit for outputting a sound wave depending on the modulated signal output from the modulator. The compensation processing unit compensates the audible band signal based on a distance from the sound emission unit to the listening position. This sound reproduction apparatus can reproduce the original audible band signal with a high fidelity regardless of the listening position.
摘要:
A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要:
A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.