公开(公告)号：US20240262019A1

公开(公告)日：2024-08-08

申请号：US18107121

申请日：2023-02-08

申请人： ASMPT Singapore Pte. Ltd.

发明人： Teng Hock KUAH ,  Kai Yew LEE ,  Ji Yuan HAO ,  Jian Jun CHEN ,  Yi LIN

IPC分类号： B29C43/18 ,  B29C43/00

CPC分类号： B29C43/183 ,  B29C43/003 ,  B29C2043/182 ,  B29C2043/3602 ,  B29L2031/34

摘要： A molding apparatus includes a mold and a wedge structure. The mode has a first mold member and a second mold member configured to be movable towards the first mold member along a first direction, the first and second mold members cooperating in use to form a molding cavity for encapsulating an electronic component. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction to adjust contacting portions between a first contacting surface of the first wedge member and a second contacting surface of the second wedge member, thereby biasing the second mold member towards the first mold member to form the molding cavity, wherein at least one of the first and second contacting surfaces includes a first protection film attached thereon.

公开(公告)号：US20240217144A1

公开(公告)日：2024-07-04

申请号：US18557962

申请日：2022-03-22

申请人： APIC YAMADA CORPORATION

发明人： SHIGEYUKI UCHIYAMA

IPC分类号： B29C43/18 ,  B29C43/36 ,  B29C43/52 ,  B29L31/34

CPC分类号： B29C43/18 ,  B29C43/36 ,  B29C43/52 ,  B29C2043/182 ,  B29C2043/3602 ,  B29L2031/3406

摘要： The present invention addresses the problem of providing a compression molding device and a compression molding method capable of preventing deformation of electronic components and the like, mounted on a substrate, due to positional displacement of resin during transport, and capable of preventing variation in molding quality. As a solution to this problem, a compression molding device (1) according to the present invention uses a sealing die (202) provided with an upper die (204) and a lower die (206) to seal, by means of block-shaped resin (R), a substrate (Wa) on which an electronic component (Wb) is mounted, to process the same into a molded article, wherein the compression molding device is provided with a resin welding mechanism (110) for welding the resin (R) to a predetermined position on the substrate (Wa).

公开(公告)号：US11986981B2

公开(公告)日：2024-05-21

申请号：US17542173

申请日：2021-12-03

申请人： Andres Sanchez

发明人： Andres Sanchez

IPC分类号： B29C43/18 ,  B29C43/00 ,  B29C43/14 ,  B29C43/52 ,  B29K83/00 ,  B29K305/00 ,  B29L31/00

CPC分类号： B29C43/18 ,  B29C43/003 ,  B29C43/14 ,  B29C43/52 ,  B29C2043/182 ,  B29K2083/00 ,  B29K2305/00 ,  B29L2031/7132

摘要： A method for forming a silicone container having a reinforced rim. A layer of adhesive is applied to the outer surface of a metal ring. The adhesive layer is covered with a first plug of unvulcanized silicone. The first plug of unvulcanized silicone is then vulcanized to form a vulcanized silicone covered metal ring. The vulcanized silicone covered metal ring is then inserted into a mold along with a second plug of unvulcanized silicone. The second plug of unvulcanized silicone is then vulcanized so that it binds with the vulcanized silicone covered metal ring to form a silicone container having a reinforced rim. In one preferred embodiment the silicone container having a reinforced rim is a bowl. In another preferred embodiment the silicone container having a reinforced rim is a cup.

公开(公告)号：US20180243953A1

公开(公告)日：2018-08-30

申请号：US15887380

申请日：2018-02-02

申请人： TOWA CORPORATION

发明人： Yusuke SHIMODA ,  Noriyuki TAKAHASHI

IPC分类号： B29C43/36 ,  B29C43/02

CPC分类号： B29C43/36 ,  B29C33/22 ,  B29C33/303 ,  B29C43/02 ,  B29C2043/182 ,  B29C2043/366 ,  B29L2031/34

摘要： Provided is a resin-molding device 10 including: a first platen 11 and a second platen 12; a first molding die 161 to be attached to the first platen; a second molding die 162 to be attached to the second platen and arranged so as to face the first molding die; a die-clamping mechanism 133 for clamping the first and second molding dies together by decreasing the distance between the first and second platens, and for separating the first and molding dies from each other by increasing the distance between the first and second platens; and a flatness adjuster 14 including an adjustment member 141 for adjusting the parallelism between the die surface of the first molding die and that of the second molding die, or the flatness of a resin-molded product to be molded with the first and second molding dies.

公开(公告)号：US20180086011A1

公开(公告)日：2018-03-29

申请号：US15278396

申请日：2016-09-28

申请人： Acushnet Company

发明人： Robert Blink ,  David A. Bulpett ,  Brian Comeau

IPC分类号： B29C70/70 ,  B29C70/68 ,  B29C43/18 ,  B29C43/00 ,  B29C43/52

CPC分类号： B29C70/70 ,  B29C35/02 ,  B29C43/14 ,  B29C55/10 ,  B29C70/682 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0844 ,  B29C2035/085 ,  B29C2035/0877 ,  B29C2043/182 ,  B29C2043/189 ,  B29K2021/006 ,  B29K2101/10 ,  B29L2031/546

摘要： Method of making a golf ball comprising: providing a subassembly and a thermoset polymer composition; partially curing the thermoset polymer composition and elongating same while in a partial cure state; forming a layer about the subassembly comprising the thermoset polymer composition; and further curing the thermoset polymer composition. A moldable thermoset polymer composition may be elongated while in state of partial cure. The thermoset polymer composition may be stepwise elongated by: stretching a thermoset polymer composition in at least one plane while in partial cure state and before forming into first and second half shells; forming the thermoset polymer composition into first and second half shells and elongating the thermoset polymer composition in three dimensions while in the partial cure state and before mating the first and second half shells about the subassembly; and mating the first and second half shells about the subassembly and forming a stepwise-elongated thermoset layer.

公开(公告)号：US20170306718A1

公开(公告)日：2017-10-26

申请号：US15496920

申请日：2017-04-25

申请人： Kyle Tse ,  Colby Jarrett

发明人： Kyle Tse ,  Colby Jarrett

IPC分类号： E21B33/134 ,  E21B33/12 ,  B29C43/18 ,  B29L9/00 ,  B29L31/26

CPC分类号： E21B33/134 ,  B29C43/18 ,  B29C2043/182 ,  B29L2009/00 ,  B29L2031/26 ,  E21B33/1204

摘要： An apparatus and a technique related to a composite member of two different composite materials is disclosed. Aspects include a technique which may include forming a first portion using a first composite material and forming a second portion molding a second composite material over the first portion. Aspects further include a millable frac or bridge plug may be created.

公开(公告)号：US09707725B2

公开(公告)日：2017-07-18

申请号：US14603430

申请日：2015-01-23

申请人： GLOBAL IP HOLDINGS, LLC

发明人： Darius J. Preisler ,  Christopher A. Heikkila

IPC分类号： B29C43/18 ,  B29C70/46 ,  B29K23/00 ,  B29L7/00 ,  B29C43/10 ,  B29C43/56

CPC分类号： B29C70/46 ,  B29C43/10 ,  B29C43/18 ,  B29C2043/182 ,  B29C2043/563 ,  B29K2023/12 ,  B29L2007/002

摘要： A method of making a sandwich-type, compression-molded, composite component having improved surface appearance is provided. Reinforced thermoplastic skins, first and second sheets of thermoplastic adhesive and a cellulose-based core of a blank or stack of sandwich materials are heated to a softening temperature of the thermoplastics. The heated blank or stack is allowed to cool in the mold cavity until inner surfaces of the skins are bonded to top and bottom surfaces of the core by the sheets to seal core cavities. Air in the sealed cavities urges softened portions of the sheets and portions of the core inwardly towards the cavities of the core as the air in the cavities cools to inhibit debossing and improve surface appearance of a first outer surface of the blank or stack.

公开(公告)号：US09586094B2

公开(公告)日：2017-03-07

申请号：US14292306

申请日：2014-05-30

申请人： DUNLOP SPORTS CO., LTD.

发明人： Ayaka Shindo ,  Chiemi Mikura ,  Ryota Sakamine ,  Sho Goji

IPC分类号： A63B37/06 ,  A63B37/00 ,  B29C43/18 ,  B29C43/00 ,  B29K9/00 ,  B29K75/00 ,  B29K105/00 ,  B29L9/00 ,  B29L31/54 ,  B29K33/00

CPC分类号： A63B37/0074 ,  A63B37/0007 ,  A63B37/0018 ,  A63B37/0051 ,  A63B37/0063 ,  A63B37/0075 ,  A63B37/0076 ,  A63B37/0092 ,  A63B37/0096 ,  A63B2037/0079 ,  B29C43/003 ,  B29C43/18 ,  B29C2043/182 ,  B29K2009/00 ,  B29K2033/00 ,  B29K2075/00 ,  B29K2105/0032 ,  B29K2105/0085 ,  B29K2105/0088 ,  B29K2995/007 ,  B29L2009/00 ,  B29L2031/546

摘要： A method for manufacturing a golf ball showing a great flight distance on driver shots for includes the steps of: preparing a rubber composition containing a base rubber, an α,β-unsaturated carboxylic acid having 3 to 8 carbon atoms and/or a metal salt thereof as a co-crosslinking agent, a crosslinking initiator and a carboxylic acid and/or a salt thereof; heat pressing the rubber composition at a press temperature ranging from t-40° C. to t-15° C. to mold a spherical core, wherein t ° C. is a one-minute half-life temperature of the crosslinking initiator; and forming at least one cover layer covering the spherical core.

摘要翻译： 一种在驾驶员镜头上显示出飞行距离大的高尔夫球的方法包括以下步骤：制备含有基础橡胶，具有3-8个碳原子的α，β-不饱和羧酸和/或金属盐的橡胶组合物 作为共交联剂，交联引发剂和羧酸和/或其盐; 在t-40℃至t-15℃的压力温度下对橡胶组合物进行热压，以成型球形芯，其中t℃为交联引发剂的1分钟半衰期; 以及形成覆盖所述球形芯的至少一个覆盖层。

公开(公告)号：US09573024B2

公开(公告)日：2017-02-21

申请号：US14144901

申请日：2013-12-31

申请人： NIKE, Inc.

发明人： Aaron Bender

IPC分类号： A63B37/04 ,  A63B37/06 ,  A63B45/00 ,  B29C69/02 ,  A63B37/00 ,  B33Y10/00 ,  B33Y80/00 ,  B29D99/00 ,  B29C67/00 ,  B29C43/18 ,  B29C45/14 ,  B29K21/00 ,  B29K101/12 ,  B29K75/00 ,  B29L31/54

CPC分类号： A63B45/00 ,  A63B37/0038 ,  A63B37/0051 ,  A63B37/0064 ,  A63B37/0074 ,  A63B37/0075 ,  A63B37/0076 ,  B29C43/18 ,  B29C45/14819 ,  B29C64/118 ,  B29C64/336 ,  B29C67/0055 ,  B29C69/02 ,  B29C2043/182 ,  B29C2043/189 ,  B29D99/0042 ,  B29K2021/003 ,  B29K2075/00 ,  B29K2101/12 ,  B29L2031/546 ,  B33Y10/00 ,  B33Y80/00

摘要： A method of forming a golf ball includes forming a core using a 3D printer, and molding a cover in a surrounding position over the core through at least one of compression molding and injection molding. The core may be formed by printing a first core portion, printing a second core portion, and fusing the first core portion with the second core portion to form the core. Each of the first and second core portions may respectively include a plurality of concentric shells that are sequentially constructed.

摘要翻译： 形成高尔夫球的方法包括使用3D打印机形成芯，并且通过压缩成型和注射成型中的至少一个将围绕位于芯上的覆盖物成型在芯上。 芯可以通过印刷第一芯部分，印刷第二芯部分以及将第一芯部分与第二芯部分熔合而形成芯。 第一和第二芯部中的每一个可以分别包括依次构造的多个同心壳。

公开(公告)号：US09370694B2

公开(公告)日：2016-06-21

申请号：US13444652

申请日：2012-04-11

申请人： Robert Luciano, Jr. ,  Warren White ,  David Grieshaber

发明人： Robert Luciano, Jr. ,  Warren White ,  David Grieshaber

IPC分类号： G08B13/14 ,  A63B67/02 ,  A63B57/00 ,  A63B37/00 ,  A63B43/06 ,  A63B37/04 ,  G01B5/02 ,  A63B43/00 ,  A63B24/00

CPC分类号： B29C43/18 ,  A63B37/0003 ,  A63B43/00 ,  A63B2024/0037 ,  A63B2220/10 ,  A63B2225/15 ,  A63B2225/52 ,  A63B2225/54 ,  B29C2043/182 ,  B29L2031/546

摘要： A compressible core with an RFID tag is described. The compressible core includes an RFID integrated circuit, a carrier material, a molded compressible core, and a fill material. The RFID integrated circuit includes a memory that stores at least one unique identifier. The carrier material includes an RFID antenna electrically coupled to the RFID integrated circuit. The molded compressible core has a center and a spherical surface. Additionally, the molded compressible core includes a molded impression that receives the carrier material with the antenna and RFID integrated circuit. The fill material fills the molded impression occupied by the inlay.

摘要翻译： 描述了具有RFID标签的可压缩芯。 可压缩芯包括RFID集成电路，载体材料，模制的可压缩芯和填充材料。 RFID集成电路包括存储至少一个唯一标识符的存储器。 载体材料包括电耦合到RFID集成电路的RFID天线。 模制的可压缩芯具有中心和球形表面。 此外，模制的可压缩芯包括用天线和RFID集成电路接收载体材料的模制印模。 填充材料填充由嵌体占据的模制印模。