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公开(公告)号：US5073455A
公开(公告)日：1991-12-17
申请号：US302752
申请日：1989-01-26
申请人： Katsuhiko Nose , Katsuaki Kuze , Hideaki Tatsuta
发明人： Katsuhiko Nose , Katsuaki Kuze , Hideaki Tatsuta
IPC分类号： C08J7/04 , C08L85/04 , C09D129/14 , C09D143/00 , C09D171/08 , C09D175/06
CPC分类号： C09D143/00 , C08J7/047 , C08L85/04 , C09D129/14 , C09D175/06 , C08J2323/06 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/31504 , Y10T428/31536 , Y10T428/31551 , Y10T428/31786
摘要： A thermoplastic laminated film that has satisfactory adhesiveness to hydrophilic polymers, hydrophobic polymers, and inorganic substances is provided. The film comprises a base film made of thermoplastic resin and a layer formed on at least one side of said base film, wherein said layer is made of a composition comprising (a) at least one selected from the group consisting of water-soluble resins, water-emulsifiable resins, and water-dispersible resins, and (b) an organic boron polymer or a mixture composed of an organic boron polymer and vinyl alcohol polymer.
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2.发明申请公开(公告)号：US20080029779A1
公开(公告)日：2008-02-07
申请号：US11882598
申请日：2007-08-02
申请人： Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
发明人： Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
CPC分类号： B29C45/02 , B29C45/14655 , B29K2995/0018 , B41F15/12 , B41F15/40 , H01L33/20 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2933/0041 , H01L2924/00 , H01L2924/00014
摘要： A fluorescence-containing material injection apparatus of the present invention includes a fluorescence-containing material temperature control section, a fluorescence-containing material stirring section, a fluorescence-containing material remaining amount sensor, and a fluorescence-containing material injection amount adjustment section, by which disproportion in the mixture ratio of contaminates in a fluorescence-containing material M is restrained. This makes it possible to evenly apply a fluorescence-containing material onto a semiconductor light emitting element.
摘要翻译： 本发明的含荧光材料注入装置包括含荧光的材料温度控制部分，含荧光材料搅拌部分，含荧光物质剩余量传感器和含荧光物质注入量调节部分，由 抑制含荧光材料M中污染物的混合比例的不均衡。 这使得可以将含荧光的材料均匀地施加到半导体发光元件上。
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3.发明授权公开(公告)号：US07938636B2
公开(公告)日：2011-05-10
申请号：US11882598
申请日：2007-08-02
申请人： Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
发明人： Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
CPC分类号： B29C45/02 , B29C45/14655 , B29K2995/0018 , B41F15/12 , B41F15/40 , H01L33/20 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2933/0041 , H01L2924/00 , H01L2924/00014
摘要： A fluorescence-containing material injection apparatus of the present invention includes a fluorescence-containing material temperature control section, a fluorescence-containing material stirring section, a fluorescence-containing material remaining amount sensor, and a fluorescence-containing material injection amount adjustment section, by which disproportion in the mixture ratio of contaminates in a fluorescence-containing material M is restrained. This makes it possible to evenly apply a fluorescence-containing material onto a semiconductor light emitting element.
摘要翻译： 本发明的含荧光材料注入装置包括含荧光的材料温度控制部分，含荧光材料搅拌部分，含荧光物质剩余量传感器和含荧光物质注入量调节部分，由 抑制含荧光材料M中污染物的混合比例的不均衡。 这使得可以将含荧光的材料均匀地施加到半导体发光元件上。
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公开(公告)号：US06956879B2
公开(公告)日：2005-10-18
申请号：US10290294
申请日：2002-11-08
IPC分类号： G11B7/08 , G11B7/125 , G11B7/22 , H01L21/00 , H01L21/52 , H01S5/02 , H01S5/022 , H01S5/40 , H01S3/04
CPC分类号： H01L21/67259 , H01L21/67138 , H01S5/02212 , H01S5/02252 , H01S5/4031 , H01S5/4056 , Y10T29/41
摘要： The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.
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