-
公开(公告)号：US08446734B2
公开(公告)日：2013-05-21
申请号：US12295582
申请日：2007-03-30
IPC分类号： H05K7/00
CPC分类号： H05K1/0366 , B32B5/28 , B32B15/14 , H01L23/145 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H05K3/4602 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , Y10T428/24058 , Y10T428/24132 , Y10T428/249924 , Y10T428/2927 , Y10T428/2933 , Y10T442/2475 , Y10T442/30 , Y10T442/3049 , Y10T442/3919 , H01L2924/00 , H01L2224/0401
摘要： The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.
摘要翻译： 本发明涉及具有高密度电路和优异的连接可靠性和层叠可靠性的电路板。 树脂织物布（4）通过布置单个纤维（4a）或由多根单纤维构成的纤维束，该单丝纤维的线性热膨胀系数至少在两个方向上具有小的线性热膨胀系数，并交替编织 他们。 在该板上，树脂织物被树脂部分（5）覆盖，树脂部分（5）由具有大于硅的线性热膨胀系数的树脂材料制成。
-
公开(公告)号：US20100259910A1
公开(公告)日：2010-10-14
申请号：US12295582
申请日：2007-03-30
CPC分类号： H05K1/0366 , B32B5/28 , B32B15/14 , H01L23/145 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H05K3/4602 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , Y10T428/24058 , Y10T428/24132 , Y10T428/249924 , Y10T428/2927 , Y10T428/2933 , Y10T442/2475 , Y10T442/30 , Y10T442/3049 , Y10T442/3919 , H01L2924/00 , H01L2224/0401
摘要： The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.
摘要翻译： 本发明涉及具有高密度电路和优异的连接可靠性和层叠可靠性的电路板。 树脂织物布（4）通过布置单个纤维（4a）或由多根单纤维构成的纤维束，该单丝纤维的线性热膨胀系数至少在两个方向上具有小的线性热膨胀系数，并交替编织 他们。 在该板上，树脂织物被树脂部分（5）覆盖，树脂部分（5）由具有大于硅的线性热膨胀系数的树脂材料制成。
-
公开(公告)号：US5760143A
公开(公告)日：1998-06-02
申请号：US558773
申请日：1995-11-15
IPC分类号： C08G69/04 , C08G69/42 , C08G69/44 , C08G77/455 , C08F283/04
CPC分类号： C08G69/04 , C08G69/42 , C08G69/44 , C08G77/455
摘要： An ester-amide block copolymer of the formula (1): ##STR1## wherein R is an aromatic hydrocarbon group with 6-20 carbon atoms and G is a residue of an aliphatic polyester, an aliphatic polycarbonate, an aliphatic polyethercarbonate or a polyorganosiloxane, and having a weight average molecular weight of 30,000-1,000,000. This copolymer is advantageously prepared by polycondensing an activated acyl lactam-terminated aromatic amide of the formula (2) with a diol of the formula (3) by bulk polymerization in a molten state: ##STR2## wherein R and G are the same as defined above.
摘要翻译： 式（1）的酯 - 酰胺嵌段共聚物：具有6-20个碳原子的Rbon基团，G是脂族聚酯，脂族聚碳酸酯，脂族聚醚碳酸酯或聚有机硅氧烷的残基，其重均分子量 30,000-1,000,000。 通过在熔融状态下本体聚合，使式（2）的活化的酰基内酰胺封端的芳族酰胺与式（3）的二醇缩聚来制备该共聚物：其中R和G是 与上述相同。
-
公开(公告)号：US5811495A
公开(公告)日：1998-09-22
申请号：US695517
申请日：1996-08-12
申请人： Isamu Kirikihira , Hiroshi Yamakawa , Yuji Kubo
发明人： Isamu Kirikihira , Hiroshi Yamakawa , Yuji Kubo
摘要： Elastomeric block copolymers comprising polyether chains as soft segment in combination with aromatic polyamide chains as hard segment are disclosed, the soft and hard segments being introduced under a sequence control so as to develop excellent physical and mechanical properties. Processes for producing the elastomeric block copolymers are also disclosed.
摘要翻译： 公开了包含作为软链段的作为软链段的聚醚链与作为硬链段的芳族聚酰胺链组合的弹性体嵌段共聚物，所述软链段和硬链段在序列控制下被引入以产生优异的物理和机械性能。 还公开了用于制备弹性体嵌段共聚物的方法。
-
-
-
搜索结果
4 条记录 (耗时 0.021 秒)